Manufacturing issues can be a big reason why your project timelines get derailed and even result in costly failures. By understanding common errors that occur while designing or creating your …
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Ever wondered how light travels within a device? This Rand Simulation webinar will be your guide to understanding and designing optical lightguides using Ansys SPEOS. We'll explain the fundamentals of SPEOS and explore its capabilities for simulating light behavior in lightguides. Join us on Wednesday, May 22 at 2 PM ET and discover how we …
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EXPLORING OPEN COLLABORATION, INNOVATION & ENERGY TRANSITION Norris Conference Center, Houston, TX, USA | 23 May 2024 Future Digital Twin & Generative AI will explore Open Collaboration, Innovation and Energy Transition. Expert speakers will present and discuss Generative AI, Reality Capture and Digital Twins; Digital Twin and Large Language Models (LLM’s); Integrated Value Chains, Decarbonisation and Digital …
Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …
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This event is in-person only -- there is no support for remote participation. Agenda 9:30 – 10:00 Registration and Check-in Coffee and networking with your peers. 10:00 – 10:05 Welcome / Intro Mel Pratt | Sr. Application Engineering Manager, Functional Verification 10:05 – 11:00 Beyond Speed: Unlocking Productivity in Simulation and Debug Moses Satyasekaran | …
Be sure to register for this high tech security webinar. You’ll learn how to identify threat scenarios quickly and why a model-based, system-oriented solution is needed to protect your hardware. TIME: MAY 23, 2024 2 P.M. CET (CENTRAL EUROPEAN TIME) Venue: Virtual Overview Connected vehicles offer a range of benefits, such as real-time data sharing, …
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Eurocrypt 2024, the 43rd Annual International Conference on the Theory and Applications of Cryptographic Techniques, will take place at Kongresshaus in Zurich, Switzerland on May 26-30, 2024. Eurocrypt 2024 is organized by the International Association for Cryptologic Research (IACR). The affiliated events will take place at ETH Zurich on May 25-26, 2024. REGISTER HERE
Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, …
Synopsys' SLM PVT Monitor (process detector, voltage monitor, temperature sensor) IP can collect voltage, temperature, and process parameters from different blocks within the IC in real time. These data can be analyzed and used to take meaningful action to optimize the performance of the chip at any stage of silicon lifecycle. This webinar focuses on …
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Webinar Content Analog/mixed-signal IC design is a critical challenge for ASIC development with tight specifications and ambitious tapeout schedules that are not easy to meet. Many manual design steps from architecture through layout verification limit the amount of early insights and force time-consuming design iterations. In this webinar, we will give you an insight into …
Join Ansys on May 30, 2024, at the Brookstreet Hotel in Ottawa for the Ansys Canada Innovation Conference. This one-day event will blend Ansys expert-led technical sessions, highlighting workflows and solutions and engaging customer presentations demonstrating proven results. Date: Thursday, May 30, 2024 Time: 8:00 AM - 3:30 PM EDT Location: The Brookstreet Hotel Ottawa …
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Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have …
