The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has …
Continue reading "Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design"
About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, …
Continue reading "TSMC EU OIP Ecosystem Forum (In-Person Event)"
This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 …
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful …
Continue reading "Webinar: Accelerating System Design Creation with Integrated Analysis"
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future …
Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with …
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …
Webinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for …
Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
