Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder …
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With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. …
The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …
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KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. …
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …
Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to …
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GenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) …
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While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program is designed to share best practices in areas such as: algorithms; applications; architectures and networks; clouds and distributed computing; data analytics, visualization, and storage; machine …
Workshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to …
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