The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and …
SURGE (Silvaco UseRs Global Event) is a worldwide event held by Silvaco. SURGE is an event for discussing new technologies, sharing user experiences, and discovering innovative techniques for advanced semiconductor …
Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming …
Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, …
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 14-track conference created by engineers …
Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE
Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
