PCI-SIG is coming to Bengaluru, India on November 11-12, 2024. Members of the PCI-SIG community including systems architects, designers, engineers, and engineering managers are invited to attend this fantastic event. Overview The PCI-SIG Developers …
A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers …
About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …
SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support …
Your benefits as a visitor electronica covers the entire world of electronics. Here you can find high-performance systems and components from the micro- and nano-worlds of semiconductor and micro systems …
About PCB Carolina Located in Raleigh (map) near Research Triangle Park makes this a prime area for this highly technical conference on electronics. There will be 16 technical sessions, a keynote address, a …
Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder …
Continue reading "Advanced Design & Manufacturing Montréal 2024"
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. …
The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …
Continue reading "TSMC Open Innovation Platform® Ecosystem Forum 2024 – China"
KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. …
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …
Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to the client, businesses can lower SaaS costs, protect user privacy and data security, and enable novel use cases when AI has access to the full …
Continue reading "Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads"
GenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) …
Continue reading "2024 Semi Industry Forum: GenAI + Semiconductors + Humanity"
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program …
Workshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to …
Continue reading "Workshop on Open-Source EDA Technology (WOSET)"
WELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. …
Continue reading "Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization"
This webinar will cover the motivations and benefits of using in-system deterministic test and how using this new technology can become a central part of any SLM strategy.
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has …
Continue reading "Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design"
About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design …
Continue reading "TSMC EU OIP Ecosystem Forum (In-Person Event)"
This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 …
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful …
Continue reading "Webinar: Accelerating System Design Creation with Integrated Analysis"
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this …
Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with …
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation to protect data, devices, and cloud. Our session will provide an overview of ICTK and its PUF technology, discuss the features and benefits of Root of Trust …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures. Learn how Cadence’s advanced automotive solutions address the increasing compute demands and in-vehicle networking requirements while prioritizing power …
Webinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed: Key Automated AFM features for process control in high volume …
Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 REGISTER HERE
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
As AI adoption grows, distribution system complexity increases, making reliability efforts crucial. Failures can be categorized and the current health monitoring schemes are closely tier to qualification methods. However, their high complexity causes lack of widespread solutions and market adoption. Infineon's Power System Reliability Modeling bridges the gap between component and system reliability, enabling in-field …
