CES 2025

Las Vegas, NV

Why CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where …

ASP-DAC 2025

Tokyo Odaiba Miraikan, Japan 2 Chome-3-6 Aomi, Koto City, Tokyo, Japan

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 …

Webinar: USB4v2: The Next Evolution in Speed and Efficiency

USB4v2: The Next Evolution in Speed and Efficiency Explore the next generation of USB technology with USB4v2, offering unprecedented data transfer speeds of up to 80Gbps, improved power delivery, and backward compatibility with USB-C and Thunderbolt devices. This webinar dives into the technical advancements, use cases, and insights into how USB4v2 is shaping the future …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  …

SURGE Virtual Event EMEA 2025

Online

Silvaco will hold its annual SURGE users event on January 21, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover innovative techniques for advanced semiconductor design. REGISTER HERE

Webinar: ESDA Savage on Security 1: Security Constructs for Heterogenous Integration

Online

The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security. New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All …

Webinar: Mastering SoC Design and Verification for DO-254 Compliance – Balancing Complexity and Safety (hosted by ConsuNova)

This course will be held Online

Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming …

SPIE Photonics West 2025

The Moscone Center The Moscone Center, San Jose, CA, United States

Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, …

DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …

Webinar: Master’s Degree in Numerical Simulation with Ansys

Online

Engineers solve today’s challenges by leveraging simulation, and the Technical University of Madrid (UPM) addresses this need with its Master’s Degree in Numerical Simulation. Developed in collaboration with Ansys, the program equips engineers to bridge the industry's skills gap by fostering a deep understanding of numerical simulation methods. It emphasizes practical applications and best practices …

DVClub Europe: Edinburgh

Edinburgh Futures Institute, The University of Edinburgh 1 Lauriston Pl, Edinburgh

Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will …

Leti Photonics Workshop 2025

San Francisco Museum of Modern Art 151 3rd Street, San Francisco, CA, United States

Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …

Semiconductor Technology Overview

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …

MD&M West 2025

Anaheim Convention Center 800 W Katella Ave, Anaheim, CA, United States

Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, and WestPack — we are now merging 4 of these related industry sectors into a single unified show: MD&M West. WestPack, well-known as the leading …

Mastering Gearbox Durability: Advanced Simulation Techniques with Ansys

Online

Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM CET / 8:30 PM IST Overview This webinar will delve into how Comer Industries, with the support of Asotech, leverages Ansys simulations to ensure the …

Product Qualification Overview

Phoenix, AZ Phoenix, AZ, United States

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …

IC Packaging Technology

Phoenix, AZ Phoenix, AZ, United States

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

Webinar: Optical Sensors for Health Monitoring: Revolutionizing Wearable Devices

Online

Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February 13th, 2025 Session One: 9:00am EST Session Two: 2:00pm EST Venue: Virtual Overview Join us for an in-depth look into how optical sensors are revolutionizing …

2025 IEEE International Solid-State Circuits Conference (ISSCC)

San Francisco Marriott Marquis 780 Mission Street, San Francisco, CA, United States

About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE

SMTA Wafer-Level Packaging Symposium

Hyatt Regency San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United States

Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for their active engagement throughout the symposium! The WLPS showcased a rich and diverse technical program, featuring cutting-edge presentations and discussions on semiconductor and packaging technologies. …

Webinar: Intelligent Material Selection to Meet Engineering Challenges

This course will be held Online

Products evolve over time and often need to meet new and unexpected use cases and requirements. Register for this webinar and learn how to select the best materials to overcome engineering challenges and meet demanding customer requirements. TIME: February 18, 2025 11 AM EST / 5 PM CET / 9:30 PM IST Overview The optimal …

FPGA Front Runner – Using AI in development and product for FPGA

Renishaw plc New Mills, Wotton-under-Edge, Gloucestershire, United Kingdom

FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the FPGA? How is the AI trained? Any use case example Partner FPGA Front Runner event Partner: TechWorks & Tessolve NOTE Please be aware that if you register for …

Advanced CMOS/FinFET Fabrication

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …

SEMICON Korea

PLATZ, COEX 513 Yeongdong-daero, Seoul, Gangnam-gu, Korea, Republic of

Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 is scheduled to be held from February 19 to February 21, 2025. This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With …