About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …
SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support …
Your benefits as a visitor electronica covers the entire world of electronics. Here you can find high-performance systems and components from the micro- and nano-worlds of semiconductor and micro systems …
About PCB Carolina Located in Raleigh (map) near Research Triangle Park makes this a prime area for this highly technical conference on electronics. There will be 16 technical sessions, a keynote address, a …
Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder …
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With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …
The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along …
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KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. …
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as …
Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to …
Continue reading "Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads"
GenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) …
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While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program …
Workshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to …
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WELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. …
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This webinar will cover the motivations and benefits of using in-system deterministic test and how using this new technology can become a central part of any SLM strategy.
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have …
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About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design …
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This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 10AM IST to 5PM IST Venue: Virtual Overview Ansys medini analyze is a model-based, integrated tool supporting safety analysis for safety-critical electrical and electronic (E/E) …
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful results. With in-design analysis, they can provide accurate constraints to the PCB designer and verify that these constraints are met after the design is routed. …
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Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this …
Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with the entire image chain, freeform optics, display technnology, high-performance computing for photonic devices, and other applications using the Optical Solutions suite of tools. More details …
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation to protect data, devices, and cloud. Our session will provide an overview of ICTK and its PUF technology, discuss the features and benefits of Root of Trust …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures. Learn how Cadence’s advanced automotive solutions address the increasing compute demands and in-vehicle networking requirements while prioritizing power …
Webinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed: Key Automated AFM features for process control in high volume …
Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
As AI adoption grows, distribution system complexity increases, making reliability efforts crucial. Failures can be categorized and the current health monitoring schemes are closely tier to qualification methods. However, their …
We are holding a free virtual training course specifically tailored for automotive OEMs, suppliers, and semiconductor industry professionals. This course will equip you with a better understanding of the software …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Overview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …
We'll introduce the benefits of a model-based approach in automotive safety critical software development for ISO 26262. Learn about how the qualification of SCADE benefits your software certification. Sign up …
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New EDA Tools for 5G and AI Infrastructure Design December 3, 2024 | 1:00 PM EST We're ready to share the latest release of our electronic design automation (EDA) software …
Following up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the …
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Substrate Vision Summit, organized by Soitec, gathers leading engineers and industry professionals to explore the cutting-edge developments in semiconductor materials that are shaping the future of technology. This event provides …
Overview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM …
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Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Overview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
About ICCAD-Expo In the development of China's integrated circuit design industry, the China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has been playing an important role in promoting industrial agglomeration, connecting …
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 …
Are you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant layouts on a CMOS process. Learn Anytime, …
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Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as …
Create and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle. Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions In …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …
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Explore the power of ai to transform semiconductor design & manufacturing. This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on …
