KnowMade at SEMICON Europa
Messe Munchen Munich, GermanyKnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. …
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Advanced Packaging Conference (APC) 2024
Messe Munchen Munich, GermanyChiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as …
Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads
OnlineIndependent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to the client, businesses can lower SaaS costs, protect user privacy and data security, and enable novel use cases when AI has access to the full …
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2024 Semi Industry Forum: GenAI + Semiconductors + Humanity
Computer History Museum, Mountain View, CAGenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) …
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Webinar: AI-Driven Constraint Generation for PCB and IC Package Design
OnlineWhile constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
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Webinar: AI-Driven Constraint Generation for PCB and IC Package Design
OnlineWhile constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
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Supercomputing 2024 (SC24)
Georgia World Congress Center 285 Andrew Young International Blvd NW, Atlanta, GA, United StatesProgram Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program …
Workshop on Open-Source EDA Technology (WOSET)
OnlineWorkshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to …
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Automotive Computing Conferences 2024
Munich, GermanyWELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry …
Defect-Based Testing
Munich, GermanySemiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization
OnlineJoin us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. …
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Webinar: Improving your in-system test quality with in-system deterministic test
OnlineThis webinar will cover the motivations and benefits of using in-system deterministic test and how using this new technology can become a central part of any SLM strategy.
Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
OnlineThe semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has …
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Infineon’s GaN Roadshow
Infineon Technologies 198 Champion Court, San Jose, CA, United StatesAbout Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
TSMC EU OIP Ecosystem Forum (In-Person Event)
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, …
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Webinar: Tackling the Challenges of Functional Safety and Cybersecurity – Virtual Hands-on Workshop
OnlineThis is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 …
Webinar: Accelerating System Design Creation with Integrated Analysis
OnlineWith the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful …
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Ansys IDEAS User Conference India 2024
Bengaluru, India Bengaluru, IndiaJoin us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this …
Optical Solutions User Conference
800 N Mary Ave 800 N Mary Ave, Sunnyvale, CA, United StatesLearn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with the entire image chain, freeform optics, display technnology, high-performance computing for photonic devices, and other applications using the Optical Solutions suite of tools. More details …
Webinar: Root of Trust and Secure Authentication Solutions with Tamper-Resistant PUF Technology
OnlineJoin experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation to protect data, devices, and cloud. Our session will provide an overview of ICTK and its PUF technology, discuss the features and benefits of Root of Trust …
Webinar: Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus
OnlineJoin us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …
Webinar: Automated AFM for Inline Hybrid Bonding Metrology in the Semiconductor Industry
OnlineWebinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed: Key Automated AFM features for process control in high volume …
2024 SIA Awards Dinner
Signia by Hilton San Jose 170 S Market St, San Jose, CA, United StatesDate: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 REGISTER HERE
Wafer Fab Processing
Munich, GermanySemiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Webinar: Introduction to Power System Reliability Modeling and Design Considerations
OnlineAs AI adoption grows, distribution system complexity increases, making reliability efforts crucial. Failures can be categorized and the current health monitoring schemes are closely tier to qualification methods. However, their high complexity causes lack of widespread solutions and market adoption. Infineon's Power System Reliability Modeling bridges the gap between component and system reliability, enabling in-field …
Webinar: Virtual ISO 26262 Functional Safety Software Workshop for Automotive Value Chain
OnlineWe are holding a free virtual training course specifically tailored for automotive OEMs, suppliers, and semiconductor industry professionals. This course will equip you with a better understanding of the software solutions available to help you comply with ISO26262. TIME: November 28, 2024 9:30 AM – 4:30 PM CET Venue: Virtual Overview We are holding a …
Failure and Yield Analysis
Munich, GermanyFailure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Club Formal Europe 2024 – Cambridge
Clayton Hotel Cambridge 27-29 Station Rd, Cambridge, United KingdomOverview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
SemIsrael Expo 2024
Avenue Convention Center Airport City, IsraelConnecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …
Webinar: MBSE for Safety-Critical and Fail-Operational SW Systems – EMEA
OnlineWe'll introduce the benefits of a model-based approach in automotive safety critical software development for ISO 26262. Learn about how the qualification of SCADE benefits your software certification. Sign up …
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Keysight EDA 2025 Launch Event
OnlineNew EDA Tools for 5G and AI Infrastructure Design December 3, 2024 | 1:00 PM EST We're ready to share the latest release of our electronic design automation (EDA) software suites so that you can learn how to raise your design intelligence with faster multi-domain insights and AI-enhanced workflows. Breakout Room Topics After a quick …
From Concept to Reality: Advancing Digital Twins in Semiconductor Manufacturing
SEMI HQ 673 S Milpitas Blvd., Milpitas, CA, United StatesFollowing up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the gap between theoretical concepts and real-world applications, providing participants with actionable insights and strategies to successfully develop and integrate digital twins into their operations. Further …
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Substrate Vision Summit
Hilton Santa Clara 4949 Great America Pkwy, Santa Clara, CA, United StatesSubstrate Vision Summit, organized by Soitec, gathers leading engineers and industry professionals to explore the cutting-edge developments in semiconductor materials that are shaping the future of technology. This event provides a platform for the exchange of ideas, research findings, and technological advancements that are driving the evolution of the semiconductor industry. As the demand for …
Club Formal Europe 2024 – Munich
Cadence Design Systems - Germany Mozartstraße 2, Feldkirchen, GermanyOverview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
70th Annual IEEE International Electron Devices Meeting
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for …
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Semiconductor Reliability and Product Qualification
Munich, GermanyPackage reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Club Formal Europe 2024 – Grenoble
Novotel Grenoble Centre 7 Pl. Robert Schuman, Grenoble, FranceOverview Are you ready to learn and share your ideas about the latest formal verification best practices? We are pleased to invite you to one of our in-person sessions to …
ICCAD Expo 2024
Shanghai, China Shanghai, ChinaAbout ICCAD-Expo In the development of China's integrated circuit design industry, the China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has been playing an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends. Since its establishment in 1994, ICCAD-Expo has been successfully held for 29 sessions in Shenzhen, Hangzhou, Chengdu, Wuhan, Shanghai, Zhuhai, Dalian, …
SEMICON Japan 2024
Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, JapanSEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 …
Webinar: Elevate Your Analog Layout Design to New Heights!
OnlineAre you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant layouts on a CMOS process. Learn Anytime, …
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Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities
OnlineDetails For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …
Webinar: Sustainability modeling: How to include sustainability aspects in MBSE system models
OnlineCreate and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle. Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions In …
Webinar: Accelerating Automotive SoC Design with Chiplets
OnlineJoin us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …
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PDF Solutions AI Executive Conference
St. Regis Hotel 125 3rd St, San Francisco, CA, United StatesExplore the power of ai to transform semiconductor design & manufacturing. This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on …
CES 2025
Las Vegas, NVWhy CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where …