January 5, 2026 - 11:00 AM EST January 6, 2026 – 10:00 AM JST/KST Discover the 5 Critical Mobile Market Trends Reshaping Semiconductors in 2026 Mobile AI, shifting supply chains, …
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The world’s most powerful tech event is your place to experience the innovations transforming how we live. This is where global brands get business done, meet new partners and where …
Join us at the Ritz-Carlton in Half Moon Bay, CA to get the latest insights on economic trends, market drivers, geopolitics, technology, and what these will mean for the near …
About this event Next-generation AI systems are pushing electrical, optical, and packaging technologies to their limits. Join Keysight experts as they share insights on validating 224G / 448G SerDes, preparing for emerging …
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As the quantum threat moves from theory to reality, attacks put all long-lifecycle designs at risk. In this early PQC era, simply implementing the new NIST algorithms isn't enough. Implementations …
Date: Jan 14, 2026 | 10:00 AM PST Featured Speakers: Srikanth Venkat Raman, Product Management Director, Synopsys Khader Abdel-Hafez, Scientist, Synopsys Theo Toulas, R&D Principal Engineer, Synopsys Bruce Xue, Staff Engineer, Synopsys As System-on-Chip (SoC) designs become increasingly complex, meeting test quality and cost goals requires advances in automatic test pattern generation (ATPG). Synopsys TestMAX™ ATPG is Synopsys’ state-of-the-art …
Discover the 5 Critical Manufacturing Market Trends Reshaping Semiconductors in 2026 AI-driven investments, sustainability, and advanced materials—what’s next for semiconductor manufacturing. The semiconductor manufacturing industry is undergoing a transformative period as AI-driven investments accelerate, sustainability pressures mount, and foundries navigate capacity expansion amid weak consumer demand. In this live TechInsights webinar, our manufacturing experts will …
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About this event Start the new year off right with fresh insights and sharp skills. Join Keysight experts in Calgary for an all-day Advanced Measurements Seminar and cocktail reception. This hands-on technical event features live demonstrations with the latest RF and high-speed digital technologies. Gain practical, lab-ready insights to enhance accuracy, reduce uncertainty, and push your measurement capabilities further in 2026. Lunch and cocktails are on us. …
We are pleased to offer two webinar sessions for your convenience. Please choose the time that best fits your schedule: 10:00AM – 12:00PM CET (session #1 for EMEA/APAC) 10:00AM – 12:00PM PST (session #2 for NA) Featured Speakers: Kopal Kulshreshtha, Principal Product Specialist, Synopsys Rob Dohanyos, Principal Product Specialist, Synopsys Introducing ParagonX, a powerful tool for intelligent analysis, debugging, simulation, and visualization …
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This workshop is a fast-paced, one-day program led by Prof. Dragica Vasileska and Prof. Stephen M. Goodnick. Spend the morning grounding yourself in semiconductor physics and transport, then transition in the afternoon to instructor-led, hands-on Silvaco TCAD labs (e.g., MOS Capacitors, MOSFETs, SOI Devices, FinFETs). The workshop is offered in a hybrid format. Participants have …
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Share your work, insights, and breakthroughs. The 2026 call for papers is open. SPIE Photonics West is the world’s largest optics and photonics technologies event. Present your research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum, and emerging vision technologies. Conferences and Courses: 17–22 January This is the place to be in January …
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
About this event Stay connected with the latest optical design product innovations across CODE V, LightTools, RSoft, ImSym, and our optical scattering measurement solutions. Get tips and tricks on design best practices from our experts, and network with industry peers and the Keysight Optical Design Engineering team. The user conference is held in parallel with …
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Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process, its resolution begins at the architectural level and extends through the implementation stages. This webinar examines the key obstacles designers encounter and demonstrates how our timing closure solutions deliver comprehensive support throughout the entire design process. …
In this webinar, we will explore the growing threat that AI-fueled cyberattacks pose to chip designs and how to add expert-level security verification to your design flow to minimize those risks. We will expose some of the details of the existential risk for electronic systems with real examples. We will then describe technology that easily …
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About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
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All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, …
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
From materials to metrology: pushing the limits of lithography Share your research, challenges, and breakthroughs at this leading semiconductor conference in San Jose Submit your abstract and connect with leading researchers advancing solutions in optical lithography, EUVL, patterning technologies, metrology, and process integration for semiconductor manufacturing and related applications. Call for papers is now open. …
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FSI presents the 4th annual Florida Semiconductor Summit in 2026. Join industry leaders, innovators, and exhibitioners as we explore groundbreaking developments and the evolving future of semiconductor manufacturing in Florida. You’re invited to the 2026 Florida Semiconductor Summit! From February 23rd – 25th, 2026, the Florida Semiconductor Institute is hosting the fourth annual Florida Semiconductor Summit at …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …
Making way for The IQ Era Much can happen in a year within our ecosystem of innovation and connectivity. As we build on the success of MWC25 and engage with MWC26 to activate a new theme – The IQ Era – the world is already shifting to greater heights of digital awareness. In this new age of intelligence, the way to a better future is through smarter connection: human …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
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Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and …
Explore the Ever-Expanding Optical Networking and Communications Industry Plenary Session Esteemed industry luminaries from Coherent, NVIDIA and Tesat-Spacecom will headline the event Tuesday, 17 March. These distinguished speakers will explore cutting-edge technologies, …
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar …
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About IRPS For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants …
SENSORIZATION: ENABLING A NEW INTELLIGENCE The MEMS and Sensors Executive Conference 2024 is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. Industry economic, business …
Make plans to share your work with other experts in April 2026 Present your research at the only cross-disciplinary event highlighting compelling optics and photonics technologies—from digital optics to quantum …
Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together …
The premier conference for innovators incorporating computer vision and AI in products The 2025 Summit has now concluded. Join us May 11-13, 2026! Attend an Immersive Experience At the premier …
ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies. View the 2025 Agenda Advancing Semiconductor Manufacturing Excellence ASMC is the …
Hello everyone! Welcome to the 2026 DvCon China Conference! As the chair of this conference, l am truly honored to be here with all of you. lt's exciting to gather together …
VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), …
Main Themes COMPUTEX is a leading global exhibition focused on AIoT and startups. The expo will continue with the position of “AI Next”, featuring the latest tech trends: AI & …
Welcome to IMS2026 The IEEE International MTT Symposia (IMS) (www.ims-ieee.org) is the world’s premier RF/microwave technical conference and industry exhibition. Attendees will appreciate that IMS2026 has been refreshed with the …
New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices …
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference …
CONFERENCE & EXHIBITION HPC, AI, Quantum: Powering Innovation and Sustainability ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s …
What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to …
