Advanced Packaging Summit 2026

Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era.

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