USB4v2: The Next Evolution in Speed and Efficiency Explore the next generation of USB technology with USB4v2, offering unprecedented data transfer speeds of up to 80Gbps, improved power delivery, and …
Continue reading "Webinar: USB4v2: The Next Evolution in Speed and Efficiency"
Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology. Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia). …
From aerospace to automotive to medical to high technology, the right materials and design make a huge difference in a product’s performance, cost, and sustainability. But how do you choose …
Continue reading "Webinar: Reduce Weight Using Optimal Material Selection"
Silvaco will hold its annual SURGE users event on January 21, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover …
Agenda 14:00 - 14:30DFT, SLM, In-system test Lee Harrison Tessent Product Marketing Director Siemens EDA In-System Test, A Critical element to SLM Continuous testing and monitoring of devices is required …
The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and …
SURGE (Silvaco UseRs Global Event) is a worldwide event held by Silvaco. SURGE is an event for discussing new technologies, sharing user experiences, and discovering innovative techniques for advanced semiconductor …
Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming the landscape of advanced aviation systems, offering unparalleled integration of multiple functionalities within a single chip. These compact powerhouses bring numerous advantages, from reduced power …
Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum technologies, and more. Review the lineup of outstanding plenary speakers from around the globe. Select advanced training from more than 50 …
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 14-track conference created by engineers …
Join us for a new approach to designing lumped-element filters and discover how easy such design can be while achieving the desired accuracy. TIME: January 28, 2025 11 AM EDT / 5 PM CET Venue: Virtual Overview Streamline the design of lumped-element and planar filters with Ansys Nuhertz Filter Solutions. For lumped-element filters, one approach …
Engineers solve today’s challenges by leveraging simulation, and the Technical University of Madrid (UPM) addresses this need with its Master’s Degree in Numerical Simulation. Developed in collaboration with Ansys, the program equips engineers to bridge the industry's skills gap by fostering a deep understanding of numerical simulation methods. It emphasizes practical applications and best practices …
Continue reading "Webinar: Master’s Degree in Numerical Simulation with Ansys"
Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, and WestPack — we are now merging 4 of these related industry sectors into a single unified show: MD&M West. WestPack, well-known as the leading …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM CET / 8:30 PM IST Overview This webinar will delve into how Comer Industries, with the support of Asotech, leverages Ansys simulations to ensure the …
Continue reading "Mastering Gearbox Durability: Advanced Simulation Techniques with Ansys"
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February 13th, 2025 Session One: 9:00am EST Session Two: 2:00pm EST Venue: Virtual Overview Join us for an in-depth look into how optical sensors are revolutionizing …
Continue reading "Webinar: Optical Sensors for Health Monitoring: Revolutionizing Wearable Devices"
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE
Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for their active engagement throughout the symposium! The WLPS showcased a rich and diverse technical program, featuring cutting-edge presentations and discussions on semiconductor and packaging technologies. …
Products evolve over time and often need to meet new and unexpected use cases and requirements. Register for this webinar and learn how to select the best materials to overcome engineering challenges and meet demanding customer requirements. TIME: February 18, 2025 11 AM EST / 5 PM CET / 9:30 PM IST Overview The optimal …
Continue reading "Webinar: Intelligent Material Selection to Meet Engineering Challenges"
FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the FPGA? How is the AI trained? Any use case example Partner FPGA Front Runner event Partner: TechWorks & Tessolve NOTE Please be aware that if you register for …
Continue reading "FPGA Front Runner – Using AI in development and product for FPGA"
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 is scheduled to be held from February 19 to February 21, 2025. This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With …
Discover how Ansys tools like Twin Builder ROM streamline LS-DYNA crash simulations, optimize workflows, and accelerate robust system development. TIME: February 19, 2025 11 AM ET Overview Crash simulations in LS-Dyna are essential for analyzing complex scenarios involving various physical models Fine mesh models are often used to achieve accurate results, significantly increasing computational demands. …
On February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination for innovative tech developments. This semiconductor and tech-focused exec forum will take place in a stunning brand-new venue: the Grand …
Be a part of the largest annual simulation conference in the Bay Area. We have sponsorship packages for exhibitors and speaker opportunities available. Reach out for more information. his one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, …
Attend to hear research, challenges, and breakthroughs as you gather with colleagues in San Jose Join other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications. REGISTER HERE
DVCON U.S. 2025 The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated circuits. The focus of this highly technical conference is on the practical aspects of these technologies and their use in leading-edge projects …
The average age of operating nuclear reactors worldwide, measured from their grid connection, is 31 years. The U.S. and France operate some of the oldest fleets, with average reactor ages of 41 and 36 years, respectively. In this webinar, you will understand the critical role of simulation in supporting nuclear plants' lifespan extension and how …
Continue reading "Webinar: Overcome Nuclear Power Plant Life Extension Challenges with Simulation"
The World’s Premier Mineral Exploration & Mining Convention. The annual award winning PDAC Convention in Toronto, Canada brings together up to 30,000 attendees from over 130 countries for its educational programming, networking events, business opportunities and fun. Since it began in 1932, the convention has grown in size, stature and influence. Today, it is the …
About Event IESA Vision Summit 2025 A premier event dedicated to the semiconductor and electronics industry, IESA Vision Summit 2025 brings together industry leaders, government officials, innovators, and experts to explore cutting-edge technologies, trends, and partnerships shaping the future of ESDM. Join us for the 19th edition of this IESA flagship event in Gandhinagar, where you can …
The Congress The Lab of the Future Congress series interrogates the latest advances and drivers shaping life science research, development and manufacturing, and how these advances can be harnessed to deliver much needed therapeutics at pace and scale. The Congress focuses on the changing nature of the modern research environment, the role of new and …
Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …
Continue reading "embedded world Exhibition&Conference 2025"
