SEMICON Japan 2024

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). REGISTER HERE

Webinar: Elevate Your Analog Layout Design to New Heights!

Online

Are you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant layouts on a CMOS process. Learn Anytime, …

Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities

Online

Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …

Webinar: Sustainability modeling: How to include sustainability aspects in MBSE system models

Online

Create and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle. Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions In …

CES 2025

Las Vegas, NV

Why CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where the industry’s sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Register today for CES 2025. The world’s most powerful tech …

ASP-DAC 2025

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects. …

Webinar: ESDA Savage on Security 1: Security Constructs for Heterogenous Integration

Online

The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security. New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All …

SURGE Virtual Event Japan 2025

Online

SURGE (Silvaco UseRs Global Event) is a worldwide event held by Silvaco. SURGE is an event for discussing new technologies, sharing user experiences, and discovering innovative techniques for advanced semiconductor design in the fields of TCAD, EDA, and IP. The event will be held online. We look forward to your participation. We will randomly select …

Webinar: Mastering SoC Design and Verification for DO-254 Compliance – Balancing Complexity and Safety (hosted by ConsuNova)

This course will be held Online

Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming the landscape of advanced aviation systems, offering unparalleled integration of multiple functionalities within a single chip. These compact powerhouses bring numerous advantages, from reduced power …

SPIE Photonics West 2025

The Moscone Center The Moscone Center, San Jose, CA, United States

Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum technologies, and more. Review the lineup of outstanding plenary speakers from around the globe. Select advanced training from more than 50 …

DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …

DVClub Europe: Edinburgh

Edinburgh Futures Institute, The University of Edinburgh 1 Lauriston Pl, Edinburgh

Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will …

Leti Photonics Workshop 2025

San Francisco Museum of Modern Art 151 3rd Street, San Francisco, CA, United States

Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …

Product Qualification Overview

Phoenix, AZ Phoenix, AZ, United States

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …

IC Packaging Technology

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

FPGA Front Runner – Using AI in development and product for FPGA

Renishaw plc New Mills, Wotton-under-Edge, Gloucestershire, United Kingdom

FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the FPGA? How is the AI trained? Any use case example Partner FPGA Front Runner event Partner: TechWorks & Tessolve NOTE Please be aware that if you register for …