Webinar: Elevate Your Analog Layout Design to New Heights!

Online

Are you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant layouts on a CMOS process. Learn Anytime, …

Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities

Online

Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …

Webinar: Sustainability modeling: How to include sustainability aspects in MBSE system models

Online

Create and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle. Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions In today’s dynamic business landscape, sustainability is not just a trend - it’s critical for long-term success. Organizations that effectively integrate sustainability into their engineering processes …

Webinar: Accelerating Automotive SoC Design with Chiplets

Online

Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures. Learn how Cadence’s advanced automotive solutions address the increasing compute demands and in-vehicle networking requirements while prioritizing power …

PDF Solutions AI Executive Conference

St. Regis Hotel 125 3rd St, San Francisco, CA, United States

Explore the power of ai to transform semiconductor design & manufacturing. This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI / ML solutions across the global semiconductor industry. Speakers from: ADI, …

CES 2025

Las Vegas, NV

Why CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where the industry’s sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Register today for CES 2025. The world’s most powerful tech …

ASP-DAC 2025

Tokyo Odaiba Miraikan, Japan 2 Chome-3-6 Aomi, Koto City, Tokyo, Japan

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  …

Webinar: Mastering SoC Design and Verification for DO-254 Compliance – Balancing Complexity and Safety (hosted by ConsuNova)

This course will be held Online

Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming …

SPIE Photonics West 2025

The Moscone Center The Moscone Center, San Jose, CA, United States

Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, …

DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 14-track conference created by engineers …

DVClub Europe: Edinburgh

Edinburgh Futures Institute, The University of Edinburgh 1 Lauriston Pl, Edinburgh

Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …

Leti Photonics Workshop 2025

San Francisco Museum of Modern Art 151 3rd Street, San Francisco, CA, United States

Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …

Product Qualification Overview

Phoenix, AZ Phoenix, AZ, United States

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …

IC Packaging Technology

Phoenix, AZ Phoenix, AZ, United States

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …