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Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …
Create and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle. Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions In …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …
St. Regis Hotel
125 3rd St, San Francisco, CA, United States
Explore the power of ai to transform semiconductor design & manufacturing. This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on …
Why CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where the industry’s sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Register today for CES 2025. The world’s most powerful tech …
The Ritz-Carlton, Half Moon Bay
1 Miramontes Point Rd, Half Moon Bay, CA, United States
Join us at the Ritz-Carlton in Half Moon Bay, CA to get the latest insights on economic trends, market drivers, geopolitics, technology, and what these will mean for the near …
Silvaco will hold its annual SURGE users event on January 15, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover …
SEMI World Headquarters
673 South Milpitas Blvd, Milpitas, CA, United States
Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for …
We sincerely invite you to attend the annual Silvaco Global User Conference - SURGE. This year's SURGE China will be held online from 13:00 to 17:00 Beijing time on Friday, …
Tokyo Odaiba Miraikan, Japan
2 Chome-3-6 Aomi, Koto City, Tokyo, Japan
ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 …
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA, United States
Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology. Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia). …
Silvaco will hold its annual SURGE users event on January 21, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover …
The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security. New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All …
SURGE (Silvaco UseRs Global Event) is a worldwide event held by Silvaco. SURGE is an event for discussing new technologies, sharing user experiences, and discovering innovative techniques for advanced semiconductor …
Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming …
The Moscone Center
The Moscone Center, San Jose, CA, United States
Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, …
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA, United States
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …
Edinburgh Futures Institute, The University of Edinburgh
1 Lauriston Pl, Edinburgh
Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …
San Francisco Museum of Modern Art
151 3rd Street, San Francisco, CA, United States
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
