In the fast-evolving world of monolithic microwave integrated circuit (MMIC) design, meeting higher-frequency requirements is just the beginning. Are you seeking insights on achieving dimensional accuracy for both analog and …
About Along with the evolution of technology in information and communication fields such as AI, IoT, data analysis, voice technology, etc., the pharmaceutical industry has advanced the utilization of new …
Join us for the third in a four-part series, where we will look at the comprehensive solution for hydrogen storage, from doing a quick assessment of a hydrogen tank filling …
Continue reading "Accelerate Hydrogen Adoption Using Ansys Simulation: Part 3 – Storage / Transport"
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology …
Continue reading "Webinar: Exploring the Advancement of Chiplet Technology and the Ecosystem"
Addressing the challenges early-stage companies face on their quest for research and industrialization options on the way to mass production About this event 1 hour Join us Thursday, April 18 …
Continue reading "Webinar: STMicroelectronics’ solutions to MEMS Development Challenges"
Join us on April 23rd for the 2024 R1 updates to Ansys Charge Plus. The new and enhanced features include modeling and simulation capabilities for thermionic and e-field emissions, an automated workflow for …
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Versal Adaptive SoCs 101: Quick Start Guide to Integration and Implementation Workshop BLT Engineers have successfully deployed designs to Versal devices for Clients. Learn from the experts. This 4-hour online …
Join the Cadence and AWS teams for a hands-on workshop and networking event to learn about the Cadence Cerebrus SaaS on AWS. All attendees will receive a giveaway and a chance to win raffle prizes. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization and has powered over 300 tapeouts. …
Formal Verification Formal Verification can help you find bugs earlier in the design cycle and accelerate root cause analysis. But success with Formal requires the effective selection and implementation of …
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Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained …
Continue reading "Verisium SimAI: Coverage Gaps Meet Their Match"
Powering AI with Silicon and Embedded Leadership at TSMC 2024 Technology Symposium ACL Digital, an ALTEN group company, is excited to showcase its advanced semiconductor and embedded systems expertise at …
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Join us for the final webinar in the four-part series, which offers valuable insight into understanding how simulation can help to optimize gas turbine or furnace efficiency without compromising stability …
Continue reading "Accelerate Hydrogen Adoption Using Ansys Simulation: Part 4 – Utilization"
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …
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DATE: Wednesday, April 24 TIME: 8:00am PDT | 11:00am EDT | 4:00pm BST | 8:30pm IST PSpice is a high-performance, industry-proven, mixed-signal simulator and waveform viewer for analog and mixed-signal circuits. As one of the most widely used mixed-mode circuit simulators with extensively available models from component and IC vendors, PSpice simulation technology is applicable for product design in …
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Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on …
Continue reading "Masterclass: Deploying Solido Design Environment AI Workflows on AWS"
Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new …
Continue reading "Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns"
This Manufacturing Leaders Exchange event at PeopleSpace in San Jose, CA, will be focusing on the forefront of manufacturing innovation with a special keynote and guest. Keynote: “Digital Engineering Pillars of Innovation” Abstract We are witnessing a disruption in product development and manufacturing as the physical and digital worlds merge to generate unprecedented product innovation. Because …
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A worldwide connected Event !! D&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC …
What will you find in this edition? Intelligent data management in the Insurance sector In the insurance sector, the leap to artificial intelligence not only means a deeper understanding of risks and claims, but the ability to personalize products and services in unprecedented ways. Predictive AI models enable more accurate risk assessment, while data-driven personalization …
This webinar introduces a systematic approach using Ansys optics simulation tools to analyze stray light from both optical and non-optical components. Time: April 25, 2024 Session 1: 9:00am EST Session 2: 2:00pm EST Venue: Virtual Overview Stray light refers to unwanted light reaching the optical system sensor that disrupts the intended image. Even with a …
Continue reading "Ansys 2024 R1: Stray Light Analysis with Ansys Optics"
Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multiphysics simulation in the semiconductor fabrication process. Learn more about the webinar series! TIME: THURSDAY, APRIL 25TH 11 AM EASTERN TIME Venue: Virtual Overview Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements …
Date: Thursday, April 25, 2024 Time: 14:00pm (Taipei Time) Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment can uncover SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, …
