ASP-DAC 2025

Tokyo Odaiba Miraikan, Japan 2 Chome-3-6 Aomi, Koto City, Tokyo, Japan

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 is 30th conference. ASP-DAC 2025 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects. …

SURGE Virtual Event EMEA 2025

Online

Silvaco will hold its annual SURGE users event on January 21, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover innovative techniques for advanced semiconductor design. REGISTER HERE

Webinar: ESDA Savage on Security 1: Security Constructs for Heterogenous Integration

Online

The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security. New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All …

SURGE Virtual Event Japan 2025

Online

SURGE (Silvaco UseRs Global Event) is a worldwide event held by Silvaco. SURGE is an event for discussing new technologies, sharing user experiences, and discovering innovative techniques for advanced semiconductor design in the fields of TCAD, EDA, and IP. The event will be held online. We look forward to your participation. We will randomly select …

Webinar: Mastering SoC Design and Verification for DO-254 Compliance – Balancing Complexity and Safety (hosted by ConsuNova)

This course will be held Online

Presenters: Martin Beeby, Head of Advanced Avionics Systems and Managing Director of ConsuNova EU and Janusz Kitel, DO-254 Program Manager at Aldec Inc. Abstract: System on Chip (SoC) devices are transforming …

SPIE Photonics West 2025

The Moscone Center The Moscone Center, San Jose, CA, United States

Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, …

DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …

DVClub Europe: Edinburgh

Edinburgh Futures Institute, The University of Edinburgh 1 Lauriston Pl, Edinburgh

Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will …

Leti Photonics Workshop 2025

San Francisco Museum of Modern Art 151 3rd Street, San Francisco, CA, United States

Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …

Semiconductor Technology Overview

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …

IC Packaging Technology

Phoenix, AZ Phoenix, AZ, United States

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …