Verisium SimAI: Coverage Gaps Meet Their Match

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Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained random environments, simply running more random seeds may not always address these coverage gaps effectively. Overcoming these gaps requires creativity, persistence, and technical expertise. A …

Accelerate Hydrogen Adoption Using Ansys Simulation: Part 4 – Utilization

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Join us for the final webinar in the four-part series, which offers valuable insight into understanding how simulation can help to optimize gas turbine or furnace efficiency without compromising stability in the operating conditions range, control the NOx emission, predict polarization curves, optimize design, and improve the longevity of fuel cells. Date : April 24,  …

Webinar: Thermal Solutions for Electronics Design

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Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …

Masterclass: Deploying Solido Design Environment AI Workflows on AWS

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Utilizing AWS cloud resources to accelerate variation-aware verification   AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on …

Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns

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Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new …

Digital Engineering Pillars of Innovation – Manufacturing Leaders Exchange

PeopleSpace Bay Area 1731 Technology Dr Suite 100, San Jose, CA, United States

This Manufacturing Leaders Exchange event at PeopleSpace in San Jose, CA, will be focusing on the forefront of manufacturing innovation with a special keynote and guest. Keynote: “Digital Engineering Pillars of Innovation” Abstract We are witnessing a disruption in product development and manufacturing as the physical and digital worlds merge to generate unprecedented product innovation. Because …

D&R IP-SoC Silicon Valley 2024 Day

Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United States

A worldwide connected Event !! D&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation …

Data Driven Day 2024

WiZink Center Av. de Felipe II, s/n, Madrid, Salamanca, Spain

What will you find in this edition? Intelligent data management in the Insurance sector In the insurance sector, the leap to artificial intelligence not only means a deeper understanding of risks and claims, but the ability to personalize products and services in unprecedented ways. Predictive AI models enable more accurate risk assessment, while data-driven personalization …

Ansys 2024 R1: Stray Light Analysis with Ansys Optics

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This webinar introduces a systematic approach using Ansys optics simulation tools to analyze stray light from both optical and non-optical components. Time: April 25, 2024 Session 1: 9:00am EST Session 2: 2:00pm EST Venue: Virtual Overview Stray light refers to unwanted light reaching the optical system sensor that disrupts the intended image. Even with a …

Webinar: Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions

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Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multiphysics simulation in the semiconductor fabrication process. Learn more about the webinar series! TIME: THURSDAY, APRIL 25TH 11 AM EASTERN TIME Venue: Virtual Overview Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements …

Webinar: Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis

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Date: Thursday, April  25, 2024 Time: 14:00pm (Taipei Time) Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment can uncover SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, …