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ASML- US Seeks to Halt DUV China Sales

ASML- US Seeks to Halt DUV China Sales
by Robert Maire on 07-10-2022 at 6:00 am

China Semiocnductor Ban DUV EUV

-If you can’t beat them, embargo them
-It has been reported US wants ASML to halt China DUV tools
-US obviously wants to kill, not just wound China chip biz
-Is this embargo the alternative to failed CHIPS act?
-Hard to say “do as I say, not as I do”- but US does anyway

First EUV ban now DUV ban? Are process & yieldRead More


Accellera Update: CDC, Safety and AMS

Accellera Update: CDC, Safety and AMS
by Bernard Murphy on 07-06-2022 at 6:00 am

logo accellera min

I recently had an update from Lu Dai, Chairman of Accellera, also Sr. Director of Engineering at Qualcomm. He’s always a pleasure to talk to, in this instance giving me a capsule summary of status in 3 areas that interested me: CDC, Functional Safety and AMS. I will start with CDC, a new proposed working group in Accellera. To manage… Read More


Micron kicks off the down cycle – Chops 2023 capex – Holding inventory off street

Micron kicks off the down cycle – Chops 2023 capex – Holding inventory off street
by Robert Maire on 07-02-2022 at 10:00 am

Stock Crash 2022

-Micron reports weak outlook for fiscal Q4
-2023 capex to be down versus 2022 capex of $12B & Q3’s $2B
-Company keeping inventory off street to support pricing
-Memory is usually the first shoe to drop in a down cycle

Sharp drop in demand at end of Q3…..

Micron reported a sharp drop in demand at the end of its fiscal Q3,… Read More


Semiconductor Hard or Soft Landing? CHIPS Act?

Semiconductor Hard or Soft Landing? CHIPS Act?
by Robert Maire on 07-02-2022 at 6:00 am

Off the cliff without skidmarks

-Chip cycle will come down. Only question is landing impact
-What does cyclical end do to re-shoring & build out plans?
-Is it less demand, excess supply or both? Does it matter?
-CHIP Act rescue efforts get desperate switching to threats

Any landing you can walk away from is a good one

For those of us who have been in the semiconductor… Read More


Imec Buried Power Rail and Backside Power Delivery at VLSI

Imec Buried Power Rail and Backside Power Delivery at VLSI
by Scotten Jones on 06-28-2022 at 6:00 am

Imec BPR Page 06

At the VLSI Technology Symposium Imec presented on Buried Power Rails (BPR) and Backside Power Delivery (BSPD) in a paper entitled: “Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails”. I recently had a chance to interview one of the authors, Naoto Horiguchi about the work. I have interviewed … Read More


ASML EUV Update at SPIE

ASML EUV Update at SPIE
by Scotten Jones on 06-24-2022 at 6:00 am

12051 4 SPIE2022 Smeets 0.33 NA EUV systems for High Volume Manufacturing Page 07

At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.

0.33 NA

The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More


CHIPS for America DOA?

CHIPS for America DOA?
by Robert Maire on 06-19-2022 at 6:00 am

CHIPS for America 2022
  • We think hopes for CHIPS for America is fading fast
  • Politics, Jan 6th, guns, inflation, partisanship will likely block it
  • Alternative to building US semis is knocking down China chips
  • The only political option may be more restrictions on China

Chips for America act seems drowned out by partisan screaming

We have been saying, for… Read More


Semiconductors Weakening in 2022

Semiconductors Weakening in 2022
by Bill Jewell on 06-18-2022 at 6:00 am

June 2022 companies

The semiconductor market in 2022 is weakening. Driving factors include rising inflation, the Russian war on Ukraine, COVID-19 related shutdowns in China, and lingering supply chain issues. Four of the top 14 semiconductor companies (Intel, Qualcomm, Nvidia and Texas Instruments) are expecting lower revenues in 2Q 2022 versus… Read More


Stop-For-Top IP Model to Replace One-Stop-Shop by 2025

Stop-For-Top IP Model to Replace One-Stop-Shop by 2025
by Eric Esteve on 06-17-2022 at 6:00 am

ALL Interface 2021 2026

…and support the creation of successful Chiplet business

The One-Stop-Shop model has allowed IP vendors of the 2000’s to create a successful IP business, mostly driven by consumer application, smartphone or Set-Top-Box. The industry has dramatically changed, and in 2020 is now driven by data-centric application (datacenter,… Read More


Intel 4 Deep Dive

Intel 4 Deep Dive
by Scotten Jones on 06-13-2022 at 6:00 am

Figure 1

As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).

“Intel 4 CMOS Technology Featuring Advanced FinFET TransistorsRead More