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Tim Cook’s strategy to disengage from Samsung as a supplier of LCDs, memory and processors while simultaneously creating a worldwide supply chain from the remnants of former leaders like Sharp, Elpida, Toshiba and soon Intel is remarkable in its scope and breadth. By 2014, Apple should have in place a supply chain for 500M iOS devices… Read More
Ever since the failed Intel PR stunt where Mark Bohr suggested that the fabless semiconductor ecosystem was collapsing I have been researching and writing about it. The results will be a book co-authored by Paul McLellan. You may have noticed the “Brief History of” blogs on SemiWiki which basically outline the book. If not, start… Read More
The weather in Taiwan last week was very nice, not too hot but certainly not cold. The same could be said for the TSM stock which broke $16 after the October financial report where TSMC reported a sales increase of 15% over September. Revenues for this year thus far increased 19% over last year so why isn’t TSM stock at $20 like I predicted… Read More
More than one year old now, TSMC’s soft IP quality assessment program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass checks that create detailed reports of the completeness and robustness of soft IP. This soft IP quality program has been the first to be initiated by a Silicon foundry on other than “Hard IP”,… Read More
The common theme amongst semiconductor ecosystem conferences this year is FinFETS, probably the most exciting technology we will see this decade. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain.
In planar… Read More
Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More
On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.
IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More
The second annual TSMC Open Integration Platform Ecosystem Forum was last week and let me tell you it was excellent. Great update on the TSMC process technology road maps, great for networking within the fabless semiconductor ecosystem, great for seeing what’s new in EDA and IP, and great for SemiWiki. It was time well spent for … Read More
Looking at the Press Release (PR) flow, it was interesting to see how TSMC has solved a communication dilemma. At first, let’s precise that #1 Silicon foundry has to work with each of the big three EDA companies. As a foundry, you don’t want to lose any customer, and then you support every major design flow. Choosing another strategy… Read More
As SoC design has transformed from being about writing RTL and more towards IP assembly, the issue of IP quality has become increasingly important. In 2011 TSMC and Atrenta launched the soft IP qualification program. Since then, 13 partners have joined the program.
IP quality is multi-faceted but at the most basic level, an IP block… Read More
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[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)