You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 16126
[name] => Lithography
[slug] => lithography
[term_group] => 0
[term_taxonomy_id] => 16126
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 166
[filter] => raw
[cat_ID] => 16126
[category_count] => 166
[category_description] =>
[cat_name] => Lithography
[category_nicename] => lithography
[category_parent] => 0
[is_post] =>
)
ASML- better EPS but weaker revenues- 2024 recovery on track
China jumps 10% to 49%- Memory looking better @59% of orders
Order lumpiness increases with ASP- EUV will be up-DUV down
“Passing Bottom” of what has been a long down cycle
Weak revenues & orders but OK EPS
Reported revenue was Euro5.3B and EPS of Euro3.11… Read More
NVIDIA cuLitho Accelerates Semiconductor Manufacturing’s Most Compute-Intensive Workload by 40-60x, Opens Industry to New Generative AI Algorithms.
An incredible example of semiconductor industry partnerships was revealed during the Synopsys User Group (SNUG) last month. It started with a press release but there is much… Read More
Resist blur remains a topic that is relatively unexplored in lithography. Blur has the effect of reducing the difference between the maximum and minimum doses in the local region containing the feature. Blur is particularly important for EUV lithography since EUV lithography is prone to stochastic fluctuations and also driven… Read More
The majority of EUV production is on 5nm and 3nm node, implemented by late 2022. Metal oxide resists have not been brought into volume production yet [1,2], meaning that only organic chemically amplified resists (CARs) have been used instead until now. These resists have a typical absorption coefficient of 5/um [3,4], which means
…
Read More
The discussion of any particular lithographic application often refers to imaging a single pitch, e.g., 30 nm pitch for a 5nm-family track metal scenario. However, it is always necessary to confirm the selected patterning techniques on the actual use case. The 7nm, 5nm, or 3nm 6-track cell has four minimum pitch tracks, flanked… Read More
EUV lithography is a complicated process with many factors affecting the production of the final image. The EUV light itself doesn’t directly generate the images, but acts through secondary electrons which are released as a result of ionization by incoming EUV photons. Consequently, we need to be aware of the fluctuations… Read More
On a DRAM chip, the patterning of features outside the cell array can be just as challenging as those within the array itself. While the array contains features which are the most densely packed, at least they are regularly arranged. On the other hand, outside the array, the regularity is lost, but the in the most difficult cases, … Read More
- Reports suggest Intel will get 6 of 10 ASML High NA tools in 2024
- Would give Intel a huge head start over TSMC & Samsung
- A big gamble but a potentially huge pay off
- Does this mean $4B in High NA tool sales for ASML in 2024?
News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024
An industry news source, Trendforce, reports… Read More
In recent advanced nodes, via and cut patterning have constituted a larger and larger portion of the overall BEOL mask count. The advent of SALELE [1,2] caused mask count to increase for EUV as well, resulting in costs no longer being competitive with DUV down to 3nm [3]. Further development by TEL [4] has shown the possibility for… Read More
The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More
CHIPS Act dies because employees are fired – NIST CHIPS people are probationary