In the SoC world, we can’t believe our good luck. Every product maker now wants bespoke silicon solutions with the most advanced AI, communications, SLAM, etc. Which is fantastic for business, but this level of demand also drags us into a new level of accountability, especially in requirements traceability. Time was that only … Read More
Semiconductor Intellectual Property
Meet Kandou’s Frank Lavety, Behind the Scenes Point Person for Timely Product Delivery
I learned about Kandou a year ago and liked what I heard, as should anyone who wants higher res displays and faster downloads from their electronic devices. I’ve been tracking Kandou since and believe it’s living up to its goal to be the undisputed innovator in high-speed, energy-efficient chip-to-chip link solutions to improve… Read More
Scaling is Failing with Moore’s Law and Dennard
Looking backward and forward, the white paper from Codasip “Scaling is Failing” by Roddy Urquhart provides an interesting history of processor development since the early 1970s to the present. However it doesn’t stop there and continues to extrapolate what the chip industry has in store for the rest of this decade. For the last… Read More
High-speed, low-power, Hybrid ADC at IP-SoC
Andrew Levy and I both worked at Intel and Opmaxx, and I knew that he was now working at Alphacore, an IP company specializing in mixed-signal, RF, imaging and rad-hard applications. I was curious what Alphacore was up to, so at the IP-SoC Silicon Valley 2022 event I watched the ADC presentation from Ken Potts, COO of Alphacore. Mr.… Read More
Designing Ultra-Low-Power, Always On IP
It’s popular to use DSP chips for vision processing in diverse applications like ADAS, security cameras and AR. Tensilica has been designing DSP chips and IP since 1997, and their technology was successful enough that Cadence acquired Tensilica back in 2013. At the IP-SoC Silicon Valley 2022 event in April I had the pleasure… Read More
Advantages of Large-Scale Synchronous Clocking Domains in AI Chip Designs
We are currently in the hockey stick growth phase of AI. Advances in artificial intelligence (AI) are happening at a lightning pace. And, while the rate of adoption is exploding, so is model size. Over the past couple of years, we’ve gone from about two billion parameters to Google Brain’s recently announced trillion-parameter… Read More
Design IP Sales Grew 19.4% in 2021, confirm 2016-2021 CAGR of 9.8%
Design IP Sales reached $5.45B in 2021, or 19.4% YoY after 16% in 2020, on-sync with semiconductor growth of 26.2% in 2021 according to WSTS. IPnest has released the “Design IP Report” in May 2022, ranking IP vendors by category (CPU, DSP, GPU & ISP, Wired Interface, SRAM Memory Compiler, Flash Memory Compiler, Library and I/O,… Read More
Bigger, Faster and Better AI: Synopsys NPUs
AI-based applications are fast advancing with evolving neural network (NN) models, pushing aggressive performance envelopes. Just a few years ago, performance requirements of NN driven applications were at 1 TOPS and less. Current and future applications in the areas of augmented reality (AR), surveillance, high-end smartphones,… Read More
Experts Talk: RISC-V CEO Calista Redmond and Maven Silicon CEO Sivakumar P R on RISC-V Open Era of Computing
India’s top VLSI Training Services company Maven Silicon, a RISC-V Global Training Partner, conducted an insightful discussion with the industry experts Ms. Calista Redmond, CEO, RISC-V International and Mr. Sivakumar P R, CEO, Maven Silicon, on the topic “RISC-V Open Era of Computing”.
To introduce RISC-V, it is a free and … Read More
Assembly Automation. Repair or Replace?
It is difficult to imagine an SoC development team not using some form of automation to assemble their SoCs; the sheer complexity of the assembly task for modern designs is already far beyond hand-crafted top-level RTLs. An increasing number of groups have already opted for solutions based on the IP-XACT integration standard.… Read More
Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside