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Semiconductor Intellectual Property
The explosive growth of large language models (LLMs) has created substantial new requirements for chip-to-chip interconnects. These very large models are trained in high-performance data centers. Multiple accelerators need to work seamlessly to make all this possible as the bandwidth between accelerators directly impacts… Read More
Dan is joined by Dr. Andreas Kuehlmann, Executive Chairman and CEO at Cycuity. He has spent his career across the fields of semiconductor design, software development, and cybersecurity. Prior to joining Cycuity, he helped build a market-leading software security business as head of engineering at Coverity which was acquired… Read More
As RISC-V adoption accelerates across the semiconductor industry, so do the concerns about hardware security vulnerabilities that arise from its open and highly customizable nature. From hardware to firmware and operating systems, every layer of a system-on-chip (SoC) design must be scrutinized for security risks. Unlike… Read More
Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More
The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There… Read More
In the early days of RISC-V adoption, applications were microcontroller-centric with no need for virtualization support. But horizons expanded and now RISC-V is appearing in application processors, very much needing to be able to virtualize multiple apps concurrently. Take another step forward to datacenter servers running… Read More
Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Design & Reuse recently held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP is now the fuel for a great deal of innovation in semiconductor design. This popular event allows IP providers to highlight the latest products and services and share a vision of the future. IP consumers can easily get updates on… Read More
A recent survey of more than 120 anonymous semiconductor professionals offers a grounded view of how the industry is evaluating non-volatile memory (NVM) technologies—and where things may be heading next.
The 2024 NVM Survey, run in late 2024 and promoted through various semiconductor-related platforms and portals including… Read More
At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.
The rapid advancement of artificial intelligence (AI) is fundamentally… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?