The speed with which The Mobile Tsunami engulfs the old PC Market is just incredible. 18 months ago the tablet and smartphone markets were considered a Green Field of Opportunity for PC OEMs and chip suppliers to graze in for the next decade. The fences, however, are closing in fast as Apple continues to drive its iOS empire into new… Read More
Semiconductor Intellectual Property
Collaboration at 28nm, 20nm and 14nm
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
Physical IP Not From ARM or Synopsys
ARM and Synopsys are well-known physical IP companies however at DAC today I met with a lesser-known company named DXCORR that has some unique offerings for cache, multi-port memory and standard cell kicker libraries. I met with:… Read More
Jasper at DAC: ARM, Broadcom, Nvidia, ST
At DAC (next week, in case you have been under a rock for the last few months) Jasper has four of their customers presenting. Of course they are also presenting themselves making a total of 5 seminars.
nVidia is presenting on Sequential Equivalency Checking for Power Optimization with JasperGold Apps. It is on Monday at 11am, Tuesday… Read More
Network on Chip in Automotive: Arteris
The recent announcement from Arteris that iC-Logic chose FlexNoC and C2C to create a flexible and high speed communication chip to respond to the increasing demand of high speed connectivity in car infotainment systems is very interesting, as it shows that SoC designed for the Automotive market segment also require advanced … Read More
Software-based Wi-Fi: DSP IP core
The recent announcement from CEVA that it has joined the Wi-Fi Alliance® to further advocate for a software-based Wi-Fi® strategy shows that the new CEVA-XC4000 DSP can be used in various communication protocols, not limited to the traditional baseband processing for the wireless handset phone, where DSP IP core usage is massive.… Read More
Semiconductor Ecosystem Keynotes: ARM 2012
Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…
First up was… Read More
Smart mobile SoCs: Intel
Talk about an unusual position. Intel finds themselves very much currently outside when it comes to mobile SoCs for phones and tablets. After several attempts at soul-searching and a true understanding of the term “low-power” (not meaning 3W, but instead < 1W), they finally have a part – in the form of “Medfield”, aka the Atom… Read More
CEVA is the undisputed DSP worldwide leader
Anybody working in the wireless handset segment probably knows that CEVA is the provider of DSP IP cores, and if you are simply a wireless handset user, you should know that the baseband digital signal processing is the function allowing your phone to process the RF (analog) signal coming from the outside world. If you have been involved… Read More
Analyzing Cortex Performance
CPAK sounds like something politicians create to collect money, but in fact it is a Carbon Performance Analysis Kit. It consists of models, reference platform, initialization software (for bare metal CPAKs) or OS binary (for Linux and Android based CPAKs). They are (or will soon be) available for ARM Cortex A9, ARM Cortex A15 and… Read More


TSMC Technology Symposium 2026 Overview