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ARM in Networking/Communications

ARM in Networking/Communications
by Paul McLellan on 10-11-2012 at 7:15 pm

I was at the Linley Processor Conference yesterday. There are two of these each year, one focused on mobile and this one, focused on networking and communications (so routers, base-stations and the like). You probably know that ARM is pretty dominant in mobile handsets (and Intel is trying to get a toe-hold although I’m skeptical… Read More


Hynix View on New, Emerging Memories

Hynix View on New, Emerging Memories
by Ed McKernan on 10-10-2012 at 11:11 am


The recent (August) flash memory summit in Santa Clara had a session devoted to ReRAM as well as featuring prominently in the keynote address by Sung Wook Park of SK Hynix. The talk includes a summary of NAND’s well known scaling issues along with approaches to 3D NAND. It turns out that they are working on three different technologies:… Read More


The Middle is A Bad Place to Be if You’re a CPU Board

The Middle is A Bad Place to Be if You’re a CPU Board
by Don Dingee on 10-09-2012 at 10:45 pm

In a discussion with one of my PR network recently, I found myself thinking out loud that if the merchant SoC market is getting squeezed hard, that validates something I’ve been thinking – the merchant CPU board market is dying from the middle out.… Read More


ReRAM Cell Switching and Trends

ReRAM Cell Switching and Trends
by Ed McKernan on 10-08-2012 at 11:41 am


Confused by the way a ReRAM cell behaves? Looking for a clear definition of the various terms used? Then check out Blogs at ReRAM-Forum.com. on recent publications appearing in the IEEE journals. The latest Blog discusses a paper published by Professor Daniele Ielmini of the Politecnico di Milano in Italy on the Resistive Switching… Read More


TSMC OIP Ecosystem Forum 2012

TSMC OIP Ecosystem Forum 2012
by Daniel Nenni on 10-07-2012 at 7:11 pm

The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.


More than 90% of the attendees last year said “this… Read More


New MIPI protocols: Unipro, LLI and CSI3 over MPHY.

New MIPI protocols: Unipro, LLI and CSI3 over MPHY.
by Eric Esteve on 10-04-2012 at 8:10 am

New MIPI protocols: Unipro, LLI and CSI3 over MPHY.

Gabriele ZARRI, Moshik RUBIN, Cadence
Sophia Antipolis, France SAME 2012 Conference – October 2 & 3, 2012 2

Abstract:

With more than 50% of the world‟s population using cellular phones and the growing number of devices that go mobile, from game consoles and media player… Read More


So British! with Mike MULLER (ARM CTO & Founder) at SAME Conference

So British! with Mike MULLER (ARM CTO & Founder) at SAME Conference
by Eric Esteve on 10-04-2012 at 5:36 am

SAME conference has started with Joel Huloux, Chairman of the MIPI Alliance, who gave a high level introduction about MIPI, rather business than technology oriented, talking to Marketing/Management audience. Extracting the main points from his presentation:

  • More than 30 specifications have been issued (Important remark:
Read More

Linley Tech Processor Conference 2012

Linley Tech Processor Conference 2012
by Daniel Nenni on 10-03-2012 at 7:46 am


Learn everything you need to know about processors for enterprise- and carrier-communications systems. We have added more Speakers and industry experts and expanded the two-day conference program with 25 % more sessions.

We will be featuring presentations on the newest processors with multiple cores, programmable data planes,… Read More


GLOBALFOUNDRIES and ARM!

GLOBALFOUNDRIES and ARM!
by Daniel Nenni on 10-02-2012 at 8:30 pm


Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More


ReRAM/CBRAM at the 2012 IEDM Conference

ReRAM/CBRAM at the 2012 IEDM Conference
by Ed McKernan on 10-02-2012 at 8:10 pm


Time flies! IEDM time is coming up again (this year on the left coast) and the conference program is now on-line. Lots of interest to the ReRAM/CBRAM community. While some trends are emerging (Hafnium Oxide appears to be the material of choice) there are still plenty of other more contentious issues. ReRAM/CBRAM has reached the … Read More