IC Analog IC Layout 800x100
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New PCI Express 3.0 Equalization Requirements

New PCI Express 3.0 Equalization Requirements
by Eric Esteve on 01-22-2013 at 9:18 am

PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for… Read More


Buying DDRn Controller IP AND Memory Model to the same IP vendor gives real TTM advantage

Buying DDRn Controller IP AND Memory Model to the same IP vendor gives real TTM advantage
by Eric Esteve on 01-17-2013 at 10:52 am

We all know the concept of “one stop shop”, becoming popular in the Design IP market. The topic we will address today is NOT the “one stop shop”, even if it looks similar, but rather that we could call “consistent design flow”.

What does that means? Simply that, if your SoC design is integrating a DDRn (LPDDR2, DDR3 or even DDR4, let’s… Read More


All Things Resistive

All Things Resistive
by Christie Marrian on 01-16-2013 at 5:03 am

A quick re-introduction of ReRAM-Forum.com which is dedicated to all things related to resistive RAM, broadly characterized as ReRAM (or RRAM) and CBRAM. The technology is seen as the ‘next generation’ non-volatile memory solution and is being developed by companies large and small for a variety of applications in storage, … Read More


Scandals Rock and Shock CES 2013!

Scandals Rock and Shock CES 2013!
by Daniel Nenni on 01-15-2013 at 7:00 pm

Like any other event, the Consumer Electronics Show in Las Vegas is not immune to unethical and inappropriate behavior. Unfortunately one of digital media’s finest got caught this year doing what most publications have done since the beginning of time. CNET bowed to pressure from above and changed the outcome of the annual… Read More


IP vendors enable SuperSpeed USB IP take off in 2012

IP vendors enable SuperSpeed USB IP take off in 2012
by Eric Esteve on 01-15-2013 at 5:09 am

SuperSpeed USB has been clearly ranked in the Interface protocols winner list, see this previous post. It could be interesting to dig into this IP market segment, determine in which applications USB 3.0 has been successfully deployed and who are the IP vendors serving this market, enabling SuperSpeed USB to take off.

SuperSpeed… Read More


Battling SoCs: QCOM vs NVDA vs Samsung

Battling SoCs: QCOM vs NVDA vs Samsung
by Daniel Nenni on 01-13-2013 at 7:00 pm

If I had to describe CES in one word it would be exhausting. There were 3,000+ vendors, 150,000+ people, lines for everything, but 100% pure excitement. Even my beautiful wife was intrigued by the technology that shapes our lives. The smart toaster was of great interest to her since she says I time my toast with the smoke alarm. The … Read More


A Brief History of Synopsys DesignWare ® IP

A Brief History of Synopsys DesignWare ® IP
by Daniel Nenni on 01-11-2013 at 9:00 am

Let’s play word association. I say “EDA”, you immediately think “Synopsys”. I say “IP” and although 15 years ago you may not, today, you think “Synopsys”. For nearly two decades, Synopsys has grown its IP business through both organic development and acquisition, with a clear focus on enabling designers to meet their time-to-market… Read More


OTP @ 2013 Common Platform Technology Forum

OTP @ 2013 Common Platform Technology Forum
by Daniel Nenni on 01-06-2013 at 9:00 pm

Sidense will be exhibiting at the Common Platform Technology Forum in Santa Clara, California on February 5, during which time they will be discussing their one-transistor, one-time programmable (1T-OTP) memory IP products. Based on their patented 1T-Fuse™ bit cell, Sidense antifuse-based 1T-OTP macros offer a secure, reliable,… Read More


Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes

Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes
by Daniel Nenni on 01-04-2013 at 7:00 pm

The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcaseRead More