As semiconductor design pushes into increasingly complex territory, driven by Ai, ML, HPC, and heterogeneous system architectures, designers are challenged to balance performance, power, and time-to-market pressures. In this landscape, network-on-chip (NoC) architectures have emerged as a foundational building block… Read More
WEBINAR: Why Network-on-Chip (NoC) Has Become the Cornerstone of AI-Optimized SoCs
By Andy Nightingale, VP of Product Management and Marketing
As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More
The IO Hub: An Emerging Pattern for System Connectivity in Chiplet-Based Designs
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
Video EP9: How Cycuity Enables Comprehensive Security Coverage with John Elliott
In this episode of the Semiconductor Insiders video series, Dan is joined by John Elliott, security applications engineer from Cycuity. With 35 years of EDA experience, John’s current focus is on security assurance of hardware designs.
John explains the importance of security coverage in the new global marketplace. He describes… Read More
Security Coverage: Assuring Comprehensive Security in Hardware Design
As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More
Arteris Simplifies Design Reuse with Magillem Packaging
Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More
Arteris at the 2025 Design Automation Conference #62DAC
Key Takeaways:
- Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
- Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Arteris Expands Their Multi-Die Support
I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
Podcast EP287: Advancing Hardware Security Verification and Assurance with Andreas Kuehlmann
Dan is joined by Dr. Andreas Kuehlmann, Executive Chairman and CEO at Cycuity. He has spent his career across the fields of semiconductor design, software development, and cybersecurity. Prior to joining Cycuity, he helped build a market-leading software security business as head of engineering at Coverity which was acquired… Read More
Leveraging Common Weakness Enumeration (CWEs) for Enhanced RISC-V CPU Security
As RISC-V adoption accelerates across the semiconductor industry, so do the concerns about hardware security vulnerabilities that arise from its open and highly customizable nature. From hardware to firmware and operating systems, every layer of a system-on-chip (SoC) design must be scrutinized for security risks. Unlike… Read More

