As I mentioned in “EDA Dead Pool” acquisitions in our industry will continue at a rapid pace. The latest victim is 10 year old French company Infiniscale who was recently purchased by Silvaco. This was more of a “let’s put your product through our massive sales and support channel” kind of deal so it will be 1 + 1 = 3 accretive for sure.… Read More
Are FinFETs too Expensive for Mainstream Chips?
One of the most common things I hear now is that the majority of the fabless semiconductor business will stay at 28nm due to the high cost of FinFETs. I wholeheartedly disagree, mainly because I have been hearing that for many years and it has yet to be proven true. The same was said about 40nm since 28nm HKMG was more expensive, which … Read More
FinFET Reliability Analysis with Device Self-Heating
At the recent TSMC OIP symposium, a collaborative presentation by Synopsys and Xilinx highlighted the importance of incorporating the local FinFET device self-heating temperature increase on the acceleration of device reliability mechanisms.… Read More
Xilinx Beats Altera to the First FinFET FPGA!
Why do I stalk the FPGA industry? Well, FPGAs are an important part of the fabless semiconductor ecosystem for two reasons: 1.) They enable very cost effective design starts which are the life’s blood of the semiconductor industry and 2.) FPGA prototyping allows designers to verify their designs before committing to silicon and… Read More
Xilinx Skips 10nm
At TSMC’s OIP Symposium recently, Xilinx announced that they would not be building products at the 10nm node. I say “announced” since I was hearing it for the first time, but maybe I just missed it before. Xilinx would go straight from the 16FF+ arrays that they have announced but not started shipping, and to the… Read More
Electromigration Analysis and FinFET Self-Heating
FinFET processes provide power, performance, and area benefits over planar technologies. Yet, a vexing problem aggravated by FinFET’s is the greater local device current density, which translates to an increased concern for signal and power rail metal electromigration reliability failures. There is a critical secondary… Read More
Is 7nm Coming to the TSMC OIP Ecosystem Forum?
This is the 5[SUP]th[/SUP] TSMC Open Innovation Platform Ecosystem Forum and it is not to be missed. Please note that the location has moved from the San Jose Convention Center to the Santa Clara Convention Center which is literally right across the street from the new Levi’s Stadium. If you haven’t been to the new stadium you really… Read More
Tackling Layout Gradient Effects in 16 nm FinFET using Layout Automation
My first exposure to automating IC layout was back in the 1980’s at Intel where I coded a layout compiler to auto-generate about 6% of a graphics processor chip. The need to use automation for IC layout continues today, and with the advent of FinFET technology there are some new challenges like layout gradient effects that … Read More
Synopsys Vision on Custom Automation with FinFET
In an overwhelmingly digital world, there is a constant cry about the analog design process being slow, not automated, going at its own pace in the same old fashion, and so on. And, the analog world is not happy with the way it’s getting dragged into imperfect automation so it can be more like the digital world. True, the analog world… Read More
Samsung: the Journey to 14nm and 10nm
At the Samsung theatre (cutely named the Samsung Open Collaboration (SoC) theater) I watched a presentation by KK Lin on using DFM to bring up their 14nm and 10nm processes. And yes, they are real. Here is a picture I took of a 14nm wafer and a 10nm wafer. Samsung announced that they would ramp 10n to volume production by the end of next… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot