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Synopsys Presents SAT-Sweeping Enhancements for Logic Synthesis

Synopsys Presents SAT-Sweeping Enhancements for Logic Synthesis
by Mike Gianfagna on 07-31-2020 at 10:00 am

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There was a “research reviewed” panel on Thursday at DAC entitled Shortening the Wires Between High-Level Synthesis and Logic Synthesis. Chaired by Alric Althoff of Tortuga Logic, the panel explored methods to deal with wire delays in high-level synthesis and logic synthesis. The four speakers and their focus were:

  • Licheng
Read More

DAC Panel – Artificial Intelligence Comes to CAD: Where’s the Data?

DAC Panel – Artificial Intelligence Comes to CAD: Where’s the Data?
by Tom Simon on 07-30-2020 at 10:00 am

Which problems are ripe for AIML

Artificial Intelligence (AI) and Machine Learning (ML) are becoming more and more commonplace in our world. We have Siri, Alexa and Google Assistant that understand our voice commands. Vision systems that recognize objects are used for facial recognition, autonomous driving, medical, geographical and many other applications.… Read More


Imec Technology Forum and ASML

Imec Technology Forum and ASML
by Scotten Jones on 07-30-2020 at 6:00 am

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On Thursday July 9 Imec held a virtual technology forum. Imec is one of the premier research organizations working on semiconductor technology and their forums are always interesting. My area of interest is process technology and the following are my observation in that area from the forum.

Luc Van Den Hove
Luc Van Den Hove is the… Read More


DAC Panel: Cadence Weighs in on AI for EDA, What Applications, Where’s the Data?

DAC Panel: Cadence Weighs in on AI for EDA, What Applications, Where’s the Data?
by Mike Gianfagna on 07-29-2020 at 6:00 am

Drivers of Convergence in Computational Software

DAC was full of great panels, research papers and chip design stories this year, the same as other years. Being a virtual show, there were some differences of course. I’ve heard attendance was way up, allowing a lot more folks to experience the technical program.  This is likely to be true for a virtual event. I’m sure we’ll see more… Read More


#57DAC – Panel Discussion of High Level Synthesis

#57DAC – Panel Discussion of High Level Synthesis
by Daniel Payne on 07-28-2020 at 10:00 am

sean dart, Cadence

Presenters took a trip down memory lane at DAC this year by having a panel discussion on HLS (High Level Synthesis) spanning from 1974 to 2020, and that time period aligns with when I first graduated from the University of Minnesota in 1978, starting chip design at Intel, then later transitioning into EDA companies by 1986. MarilynRead More


Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications

Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications
by Mike Gianfagna on 07-27-2020 at 6:00 am

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High-speed communication is a critical component for many applications, most notably in the data center. The serializer/deserializer physical interface, or SerDes PHY is the backbone of many different forms of high-speed communication for this application. Use cases include on chip, between chips, between boards and racks… Read More


VLSI Symposium 2020 – Imec Buried Power Rail

VLSI Symposium 2020 – Imec Buried Power Rail
by Scotten Jones on 07-26-2020 at 10:00 am

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The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Buried Power Rails (BPR) and I had a chance to interview one of the authors, Anshul Gupta.

As logic devices continue to scale down metal pitch is reaching a limit. Imec defines a pitch… Read More


How yieldHUB Helps Bring a New Product to Market

How yieldHUB Helps Bring a New Product to Market
by Mike Gianfagna on 07-24-2020 at 10:00 am

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Collecting and analyzing semiconductor test data is a subject that holds a special place for me. Developing a factory data collection and analysis system was my first job out of school. The company was RCA, and the factories were in Findlay, Ohio (analog/mixed signal) and West Palm Beach, Florida (digital). There was a pilot… Read More


Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


The Official SemiWiki Virtual DAC 2020 Must See List!

The Official SemiWiki Virtual DAC 2020 Must See List!
by Daniel Nenni on 07-17-2020 at 2:00 pm

57DAC Logo SemiWiki

This is going to be a record setting year for DAC content and attendance, absolutely!

My first DAC was in 1984 in Albuquerque New Mexico, right out of College, and I married my beautiful wife two months later. Thirty six DAC’s later I have four grown children, grandchildren, and the number one semiconductor design portal in the world.… Read More