This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The talk covered here focuses on a complete on-die clock … Read More
Highlights of the TSMC Technology Symposium – Part 3
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the last of three that attempts to summarize the highlights of the presentations. This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.
Key Takeaways… Read More
Blue Cheetah Technology Catalyzes Chiplet Ecosystem
There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More
Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More
Highlights of the TSMC Technology Symposium – Part 2
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the second of three that attempts to summarize the highlights of the presentations. This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.
Key… Read More
In-Chip Monitoring Helps Manage Data Center Power
Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More
Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. This presentation is from Alchip, presented by James Huang,… Read More
Highlights of the TSMC Technology Symposium – Part 1
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the first of three that attempts to summarize the highlights of the presentations.
This article focuses on the TSMC process technology roadmap, as described by the following executives:
- Y.J. Mii, SVP,
Cerebras and Analog Bits at TSMC OIP – Collaboration on the Largest and Most Powerful AI Chip in the World
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The topic at hand was full of superlatives, which isn’t surprising… Read More
WEBINAR: Addressing Verification Challenges in the Development of Optimized SRAM Solutions with surecore and Mentor Solido
After spending a significant amount of my career in the IP library business it was an easy transition to Solido Design. I spent 10+ years traveling the world with CEO Amit Gupta working with the foundries and their top customers. In fact, the top 40 semiconductor companies use Solido. IP companies are also big Solido users including… Read More


Quantum Simulation Using Decision Diagrams. Innovation in Verification