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WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1375
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 1375
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)

Machine Learning Applied to Increase Fab Yield

Machine Learning Applied to Increase Fab Yield
by Tom Dillinger on 05-25-2021 at 8:00 am

enhanced defect images

Machine learning applications have become pervasive and increasingly complex, from recommendation agents in online interactions to personal assistants for command response to (ultimately) autonomous vehicle control.  Yet, an often overlooked facet of machine learning technology is the deployment in industrial process… Read More


WEBINAR: What Makes SoC Compiler The Shortest Path from SoC Design Specification to Logic Synthesis?

WEBINAR: What Makes SoC Compiler The Shortest Path from SoC Design Specification to Logic Synthesis?
by Daniel Nenni on 05-24-2021 at 6:00 am

SoC compiler puzzle

Defacto SoC Compiler whose 9.0 release was announced recently automates the SoC design creation from the first project specifications. It covers register handling, IP and connectivity insertion at RTL, UPF and SDC file generation right to logic synthesis. As part of the generation process of RTL and design collaterals, basic… Read More


Chip Design in the Cloud – Annapurna Labs and Altair

Chip Design in the Cloud – Annapurna Labs and Altair
by Kalar Rajendiran on 05-19-2021 at 10:00 am

Compute Farm Growth

The above title refers to a webinar that was hosted by Altair on April 28th. Chip design in the cloud is not a new idea. So, what is the big deal with the above title. Sometimes titles don’t reveal the full story. Annapurna Labs happens to be an Amazon company. It used to be an independent semiconductor company that was acquired by Amazon… Read More


Extending Moore’s Law with 3D Heterogeneous Materials Integration

Extending Moore’s Law with 3D Heterogeneous Materials Integration
by Tom Dillinger on 05-18-2021 at 10:00 am

nFET Si pFET Ge

A great deal has been written of late about the demise of Moore’s Law.  The increase in field-effect transistor density with successive process nodes has slowed from the 2X every 2 1/2 years pace of earlier generations.  The economic nature of Moore’s comments 50 years ago has also been scrutinized – the reduction in cost per transistorRead More


Webinar: Challenges in creating large High Performance Compute SoCs in advanced geometries

Webinar: Challenges in creating large High Performance Compute SoCs in advanced geometries
by Daniel Nenni on 05-17-2021 at 6:00 am

Sondrel Webinar 1

When we think about Compute and AI SoCs, we often focus on the huge numbers of calculations being carried out every second, and the ingenious IPs that are able to reach such high levels of performance. However, there also exists a significant challenge in keeping the vast quantities of data flowing around the chip which is solved … Read More


Your IP Portfolio is Probably Leaking. What Can You Do About It?

Your IP Portfolio is Probably Leaking. What Can You Do About It?
by Mike Gianfagna on 05-13-2021 at 2:00 pm

Your IP Portfolio is Probably Leaking What Can You Do About It

This topic is inspired by a presentation at last year’s DAC presented by Methodics, now part of Perforce. The issues raised by the original presentation are still quite relevant in the current business climate. IP leakage is something everyone should consider as part of their normal business operations. Your design IP really … Read More


Webinar: System Level Modeling and Analysis of Processors and SoC Designs

Webinar: System Level Modeling and Analysis of Processors and SoC Designs
by Daniel Payne on 05-10-2021 at 10:00 am

exploration flow min

Engineers love to optimize their designs, but that implies that there are models and stimulus to automate the process.  Process engineers have TCAD tools, circuit designers have SPICE for circuit simulation, logic designers have gate-level simulators, RTL designers use logic simulation, but what is there for the system architects… Read More


Samtec Keynote – Power Integrity is the New Black Magic

Samtec Keynote – Power Integrity is the New Black Magic
by Mike Gianfagna on 05-10-2021 at 6:00 am

Samtec Keynote – Power Integrity is the New Black Magic

The Signal Integrity Journal recently held a half day Electronic Systems SI/PI Forum that included presentations from industry leaders covering key design topics for signal integrity and power integrity engineers. The event was sponsored by Cadence. The keynote for the event was presented by Istvan Novak, principal signal… Read More


Adaptive Power/Performance Management for FD-SOI

Adaptive Power/Performance Management for FD-SOI
by Tom Dillinger on 04-21-2021 at 10:00 am

Dolphin FD SOI FBB

A vexing chip design issue is how to achieve (or improve) performance and power dissipation targets, allowing for a wide range of manufacturing process variation (P) and dynamic operation voltage and temperature fluctuations (VT).  One design method is to analyze the operation across a set of PVT corners, and ensure sufficient… Read More


Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets

Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
by Kalar Rajendiran on 04-19-2021 at 10:00 am

Comparison of D2D PHY and XSR SerDes OpenFive

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More