The Siemens Calibre group was very busy last week at SPIE. Calling Calibre industry leading really is an understatement. Calibre is one of the reasons Moore’s Law has continued to this day. This tool is legendary. You can get more information on the Calibre landing page including product information, resource guide, blogs
IoT in Distress at MWC 2023
The talk of the table – or at least my end of the table – at the annual Cybersecurity Dinner – hosted by Copper Horse Ltd. – was the dismal state of IoT. Millions of devices are being connected – but no one is making money.
Of course that isn’t absolutely accurate. There are organizations that are able to make money in IoT,… Read More
DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!
The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More
Webinar: The Data Revolution of Semiconductor Production
How Advancements in Technology Unlock New Insights
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.
Join us on Tuesday, March … Read More
Exponential Innovation: HFSS
The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.
If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More
AMAT- Flat is better than down-Trailing tool strength offsets memory- backlog up
-Strength in trailing tools offsets weak memory resulting in flat
-Order book very volatile but backlog surprisingly still grew
-Trailing edge VS Leading edge = 50/50 – Foundry/logic over 2/3
-Not nearly as bad as Lam but not as good as ASML
AMAT posts good quarter & guide – Flat for three quarters
Applied Materials… Read More
IEDM 2023 – 2D Materials – Intel and TSMC
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More
Speeding up Chiplet-Based Design Through Hardware Emulation
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
Optimization Tradeoffs in Power and Latency for PCIe/CXL in Datacenters
PCI Express Power Bottleneck
Madhumita Sanyal, Sr. Technical Product Manager, and Gary Ruggles, Sr. Product Manager, discussed the tradeoffs between power and latency in PCIe/CXL data centers during a live SemiWiki webinar on January 26, 2023. The demands on PCIe continue to grow with the integration of multiple components… Read More
Alphawave Semi at the Chiplet Summit
The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More


AI Bubble?