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WEBINAR: Leap Ahead of the Competition with AI-Driven EDA Technology

WEBINAR: Leap Ahead of the Competition with AI-Driven EDA Technology
by Rob vanBlommestein on 07-11-2023 at 10:00 am

Synopsys.ai

The demands on today’s designs are relentless. Each generation of devices needs to be faster, smaller, more functional, more connected and more secure than the previous generation. In the face of all this, the time required for next-generation devices to hit the market is dramatically shrinking. That means the competitive landscape… Read More


Computational Imaging Craves System-Level Design and Simulation Tools to Leverage AI in Embedded Vision

Computational Imaging Craves System-Level Design and Simulation Tools to Leverage AI in Embedded Vision
by Kalar Rajendiran on 07-03-2023 at 10:00 am

Typical Pipelines

Aberration-free optics are bulky and expensive. Thanks to high-performance AI-enabled processors and GPUs with abundant processing capabilities, image quality nowadays relies more on high computing power tied to miniaturized optics and sensors. Computational imaging is the new trend in imaging and relies on the fusion … Read More


Is Your RTL and Netlist Ready for DFT?

Is Your RTL and Netlist Ready for DFT?
by Daniel Payne on 06-29-2023 at 10:00 am

Synopsys Test Family ready for DFT

I recall an early custom IC designed at Wang Labs in the 1980s without any DFT logic like scan chains, then I was confronted by Prabhu Goel about the merits of DFT, and so my journey on DFT began in earnest. I learned about ATPG at Silicon Compilers and Viewlogic, then observability at CrossCheck where I met Jennifer Scher, now she’s… Read More


Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint

Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint
by Kalar Rajendiran on 06-20-2023 at 6:00 am

Synopsys Samsung silicon wafer

Many credible market analysis firms are predicting the semiconductor market to reach the trillion dollar mark over the next six years or so. Just compare this to the more than six decades it took for the market to cross the $500 billion mark. The projected growth rate is incredible indeed and is driven by fast growing market segments… Read More


Requirements for Multi-Die System Success

Requirements for Multi-Die System Success
by Daniel Nenni on 06-16-2023 at 6:00 am

Synopsys Chiplet Report 2023

Chiplets continue to be a hot topic on SemiWiki, conferences, white papers, webinars and one of the most active chiplet enabling vendors we work with is Synopsys. Synopsys is the #1 EDA and #1 IP company so that makes complete sense.

As you may have read, I moderated a panel on Chiplets at the last SNUG which we continue to write about.

Read More

An Automated Method to Ensure Designs Are Failure-Proof in the Field

An Automated Method to Ensure Designs Are Failure-Proof in the Field
by Rob vanBlommestein on 06-13-2023 at 6:00 am

fusa white paper semiwiki

I don’t know about you, but when I think of mission-critical applications, I immediately think of space exploration or military operations. But in today’s world, mission-critical applications are all around us. Think about the cloud and how data is managed, analyzed, and shared to execute any number of tasks that have safety … Read More


Automotive IP Certification

Automotive IP Certification
by Daniel Payne on 06-05-2023 at 10:00 am

SLM min

The electrification of cars and the growth of EVs means that more semiconductor content is being added with every new vehicle model from suppliers around the globe. There are unique concerns for automotive IP in terms of reliability, security and safety over the lifetime of the vehicle. I had the pleasure to speak with Pawini MahajanRead More


Why Secure Ethernet Connections?

Why Secure Ethernet Connections?
by Daniel Payne on 05-29-2023 at 6:00 am

Ethernet Security min

While web browsing I constantly glance for the padlock symbol to indicate that the site is encrypting any of my form data by using the https prefix, which means that an SSL (Secure Sockets Layer) certificate is being used by the web hosting company. I have peace of mind knowing that my credit card information cannot be easily stolen… Read More


Chiplet Interconnect Challenges and Standards

Chiplet Interconnect Challenges and Standards
by Daniel Payne on 05-25-2023 at 10:00 am

Multi die IP min

For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More


Driving the Future of HPC Through 224G Ethernet IP

Driving the Future of HPC Through 224G Ethernet IP
by Kalar Rajendiran on 05-23-2023 at 10:00 am

Advanced DSP Implementations

The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More