While web browsing I constantly glance for the padlock symbol to indicate that the site is encrypting any of my form data by using the https prefix, which means that an SSL (Secure Sockets Layer) certificate is being used by the web hosting company. I have peace of mind knowing that my credit card information cannot be easily stolen… Read More
Chiplet Interconnect Challenges and Standards
For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More
Driving the Future of HPC Through 224G Ethernet IP
The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More
Chiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
Curvilinear Mask Patterning for Maximizing Lithography Capability
Masks have always been an essential part of the lithography process in the semiconductor industry. With the smallest printed features already being subwavelength for both DUV and EUV cases at the bleeding edge, mask patterns play a more crucial role than ever. Moreover, in the case of EUV lithography, throughput is a concern, … Read More
Chiplet Q&A with Henry Sheng of Synopsys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.
Are we
… Read MoreSynopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC
Banias Labs is a semiconductor company that develops infrastructure solutions for next-generation communications. Its target market is the high-performance computing infrastructure market including hyperscale data center, networking, AI, optical module, and Ethernet switch SoCs for emerging high-performance computing… Read More
Multi-Die Systems: The Biggest Disruption in Computing for Years
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.
Here is the preface… Read More
Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization
Are you developing or thinking about developing your own RISC-V processor? You’re not alone. The use of the RISC-V ISA to develop processors for SoCs is a growing trend. RISC-V offers a lot of flexibility with the ability to customize or create ISA and microarchitectural extensions to differentiate your design no matter your application… Read More
Feeding the Growing Hunger for Bandwidth with High-Speed Ethernet
The increasing demands for massive amounts of data are driving high-performance computing (HPC) to advance the pace in the High-speed Ethernet world. This in turn, is increasing the levels of complexity when designing networking SoCs like switches, retimers, and pluggable modules. This growth is accelerating the need for … Read More