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There’s an old adage, attributed to renowned computer scientist Andrew Tannenbaum, one that perhaps only engineers find amusing: “The nice thing about standards is that you have so many to choose from.” Nevertheless, IEEE standards arise from customer requirements in the electronics industry. Many relate… Read More
If your team is building large, complex designs that require millions of clock cycles to fully verify, you need both simulation and emulation.
Using emulation with simulation accelerates performance for dramatically reduced run times.… Read More
As I have mentioned before, semiconductor professionals are very smart people, pound for pound the smartest in the workforce in my opinion. So what happens when thousands of engineers from Qualcomm, Broadcom, Altera, and Intel get shown the door? They don’t go to work for Starbucks, they don’t go to the unemployment line, they … Read More
When you’re designing a hardware solution to plug into what is arguably the most complex system of all – the Internet – you can’t get away with a little fake traffic to test whether your box is going to do all the right things at the right performance. You have to model realistic voice, video, data and wireless traffic in… Read More
Next week is the Mentor U2U Conference in Silicon Valley. By chance I had coffee with one of the U2U keynote speakers while we were waiting for the FD-SOI Symposium to start last week and can tell you this FREE event is one you don’t want to miss:… Read More
The prevailing industry trends are clear: (1) PCB and die package designs are becoming more complex, across both mobile and high-performance applications; (2) communication interface performance between chips (and their related protocols) is increasingly demanding to verify; (3) signal integrity and power integrity issues… Read More
This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More
With verification consuming more and more of the design cycle and the increasingly complex industry standard interfaces that are now common place, Verification IP (VIP) is again a trending topic. Back in my IP days the age old question was: Is it better to use VIP from the IP vendor? Because you know it will work, right? Or is it better… Read More
Steve Bailey entertained us during lunch on Tuesday with a talk on debug and visualization in the Mentor platform. Steve is based in Colorado, so had to spend the first part of his talk gloating about their Super Bowl win, but I guess he deserves that.
On a more technical note, he showed us a familiar survey they had completed with the… Read More
Who can present seventy six slides in sixty minutes, still have time for questions, AND make it interesting? Dr. Walden Rhines that’s who. Here is a link to the presentation but I have to warn you, it is a 100MB PDF file:
Design Verification Challenges: Past, Present, and Future
The DVCon conference was well attended again this year… Read More
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