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Congratulations Dr. Walden C. Rhines!

Congratulations Dr. Walden C. Rhines!
by Daniel Nenni on 09-08-2015 at 1:00 pm

A funny thing happened at the Design Automation Conference last June in San Francisco. I was browsing the Kaufman award winner mug shots in the EDAC booth and noticed that Wally Rhines was NOT a winner. You can see them HERE. Immediately in disbelief I said to myself: Self, how can this be? Joe Costello, Aart de Geus, and some other guys… Read More


Resolution Enhancement Technology – the key to Moore’s Law

Resolution Enhancement Technology – the key to Moore’s Law
by Tom Dillinger on 09-06-2015 at 10:00 am

The ability to extend photolithography utilizing 193i light sources to current process nodes is truly the key technical achievement that has enabled Moore’s Law to continue. The interplay between the exposure equipment, the materials – especially, resists and related coatings – and the fundamental principles… Read More


For high-volume manufacturing at 10 nm and below: technology and friendship

For high-volume manufacturing at 10 nm and below: technology and friendship
by Beth Martin on 09-03-2015 at 4:00 pm

The technology for 10 nm is settled, but what about 7 nm and 5 nm? Those nodes will happen with silicon-based CMOS and 193nm immersion lithography, but exactly how is still being worked out. Right now, though, the focus is on getting 10 nm chips into high-volume production. TSMC and Intel both claim to be on track for high-volume manufacturing… Read More


Test Driving Analog/Mixed Signal Design for the Internet of Things

Test Driving Analog/Mixed Signal Design for the Internet of Things
by Beth Martin on 08-25-2015 at 12:00 pm

The Internet of Things (IoT) is creating urgent demand for a new generation of analog/mixed-signal (AMS) designs, some of which also contain MEMs. To efficiently create the myriad of AMS devices at the edge of the IoT requires a design environment that is affordable and easy to use, but powerful enough to create the widely diverse… Read More


Testing Ethernet with virtual co-modeling

Testing Ethernet with virtual co-modeling
by Don Dingee on 08-24-2015 at 12:00 pm

Ethernet is suddenly a hot topic in SoC design again. The biggest news may be this: it’s not just the cloud and enterprise networks. Those are still important applications. The cloud is driving hard for more ports at 25G server and 100G switch speeds according to a recent Dell’Oro Group report. Enterprise networks are driving for… Read More


Mentor 2Q Results

Mentor 2Q Results
by Paul McLellan on 08-21-2015 at 7:00 am

So it was Mentor’s turn yesterday after Synopsys on Wednesday. And yes, it really is the end of their second quarter. They produced some very good results. As Wally opened:The second quarter of fiscal 2016 was one of record for Q2. We substantially exceed our own expectations was revenue of $281.1 million and non-GAAP earningsRead More


Meeting Demand as Fab Capacity is Stretched Again

Meeting Demand as Fab Capacity is Stretched Again
by Tom Simon on 08-11-2015 at 8:00 pm

Global semiconductor production capacity and its utilization level are key elements of the technology economy. During a panel at DAC in June Mentor Graphics posited that we are entering into a period where leading edge processes will be in high demand and also older nodes are seeing increasing demand due to Internet of Things designs… Read More


Never Imagined So Easy Class-based Testbench Debugging

Never Imagined So Easy Class-based Testbench Debugging
by Pawan Fangaria on 08-09-2015 at 7:00 am

When it comes to debugging a design testbench organized in object-oriented style with objects, component hierarchies, macros, transactions and so on, it becomes an onerous, tasteless, and thankless task for RTL verification engineers who generally lag in software expertise. Moreover, class-based debugging tools have lagged… Read More


Addressing Moore’s Law with the First Law of Real Estate: Location, location, location

Addressing Moore’s Law with the First Law of Real Estate: Location, location, location
by Beth Martin on 08-02-2015 at 7:00 am

Design sizes and complexities have grown exponentially (it’s a Law!), and consequentially the task of silicon test has become proportionally more expensive. The cost of testing a device is proportional to the amount of test data that is applied, and therefore the time it takes, which in turn is proportional to both design size … Read More


Boost the Market for Interposer and 3D ICs with Assembly Design Kits

Boost the Market for Interposer and 3D ICs with Assembly Design Kits
by Beth Martin on 07-29-2015 at 6:00 pm

The traditional system-on-chip (SoC) design process has fully qualified verification methods embodied in the form of process design kits (PDKs). Why is it that chip design companies and assembly houses have no IC/package co-design sign-off verification process?

Package die are often produced using multiple processes and… Read More