The last few years have seen multiple disruptions in the supply chain in many industries. One of the key technologies that many fingers have pointed to is the semiconductor technology. As products in all industries become more electronics based, semiconductors play a key role since no end system could function today without … Read More
Five Key Workflows For 3D IC Packaging Success
An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
- System Co-Optimization (STCO) approach
- Transition from design-based to systems-based optimization
- Expanding the supply chain and tool
IC Layout Symmetry Challenges
Many types of designs, including analog designs, MEMs, and image sensors, require electrically matched configurations. This symmetry has a huge impact on the robustness of the design across process variations, and its performance. Having an electrically matched layout basically means having a symmetric layout. To check … Read More
Verifying 10+ Billion-Gate Designs Requires Distinct, Scalable Hardware Emulation Architecture
In a two-part series, Lauro Rizzatti examines why three kinds of hardware-assisted verification engines are a must have for today’s semiconductor designs. To do so, he interviewed Siemens EDA’s Vijay Chobisa and Juergen Jaeger to learn more about the Veloce hardware-assisted verification systems.
What follows is part one,… Read More
UVM Polymorphism is Your Friend
Rich Edelman of Siemens EDA recently released a paper on this topic. I’ve known Rich since our days together back in National Semi. And I’ve always been impressed by his ability to make a complex topic more understandable to us lesser mortals. He tackles a tough one in this paper – a complex concept (polymorphism) in a complex domain… Read More
Delivering 3D IC Innovations Faster
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
Digital Twins Simplify System Analysis
The ability to digitally replicate physical systems has been used to model hardware operations for many years, and more recently, digital twining technology has been applied to electronic systems to better simulate and troubleshoot the systems. As explained by Bryan Ramirez, Director of Industries, Solutions & Ecosystems,… Read More
Coverage Analysis in Questa Visualizer
Coverage analysis is how you answer the question “have I tested enough?” You need some way to quantify the completeness of our testing; coverage is how you do that. Right out of the gate this is a bit deceptive. To truly cover a design our tests would need to cover every accessible state and state transition. The complexity of that task… Read More
EDA in the Cloud with Siemens EDA at #59DAC
Tuesday at DAC I had the pleasure of attending the Design on Cloud Theatre where experts from Siemens EDA gave an update on what they’ve been offering to IC and systems designers. I remember attending a cloud presentation from Craig Johnson in 2021, so I was keen to note what had changed in the past 12 months.
Industry Trends,
… Read MoreCalibre, Google and AMD Talk about Surge Compute at #59DAC
In 2022 using the cloud for EDA tasks is a popular topic, and at DAC this year I could see a bigger presence from the cloud hardware vendors in the exhibit area, along with a growing stampede of EDA companies. Tuesday at DAC there was a luncheon with experts from Siemens EDA, Google and AMD talking about surge compute. I already knew Michael… Read More