WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 749
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 749
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)
            
Q2FY24TessentAI 800X100
WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 749
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 749
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)

Resilient Supply Chains a Must for Electronic Systems

Resilient Supply Chains a Must for Electronic Systems
by Dave Bursky on 09-01-2022 at 10:00 am

three phase approach to supply chain resilence

The last few years have seen multiple disruptions in the supply chain in many industries. One of the key technologies that many fingers have pointed to is the semiconductor technology.  As products in all industries become more electronics based, semiconductors play a key role since no end system could function today without … Read More


Five Key Workflows For 3D IC Packaging Success

Five Key Workflows For 3D IC Packaging Success
by Kalar Rajendiran on 08-31-2022 at 6:00 am

3D IC design workflows

An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.

  • System Co-Optimization (STCO) approach
  • Transition from design-based to systems-based optimization
  • Expanding the supply chain and tool
Read More

IC Layout Symmetry Challenges

IC Layout Symmetry Challenges
by Daniel Payne on 08-29-2022 at 10:00 am

1D symmetry

Many types of designs, including analog designs, MEMs, and image sensors, require electrically matched configurations. This symmetry has a huge impact on the robustness of the design across process variations, and its performance. Having an electrically matched layout basically means having a symmetric layout. To check … Read More


Verifying 10+ Billion-Gate Designs Requires Distinct, Scalable Hardware Emulation Architecture

Verifying 10+ Billion-Gate Designs Requires Distinct, Scalable Hardware Emulation Architecture
by Daniel Nenni on 08-29-2022 at 6:00 am

960 x 540 Veloce

In a two-part series, Lauro Rizzatti examines why three kinds of hardware-assisted verification engines are a must have for today’s semiconductor designs. To do so, he interviewed Siemens EDA’s Vijay Chobisa and Juergen Jaeger to learn more about the Veloce hardware-assisted verification systems.

What follows is part one,… Read More


UVM Polymorphism is Your Friend

UVM Polymorphism is Your Friend
by Bernard Murphy on 08-17-2022 at 6:00 am

Polymorphism min

Rich Edelman of Siemens EDA recently released a paper on this topic. I’ve known Rich since our days together back in National Semi. And I’ve always been impressed by his ability to make a complex topic more understandable to us lesser mortals. He tackles a tough one in this paper – a complex concept (polymorphism) in a complex domain… Read More


Delivering 3D IC Innovations Faster

Delivering 3D IC Innovations Faster
by Kalar Rajendiran on 08-16-2022 at 6:00 am

System Technology Co Optimization STCO

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More


Digital Twins Simplify System Analysis

Digital Twins Simplify System Analysis
by Dave Bursky on 08-15-2022 at 6:00 am

Siemens Digital Twin SemiWiki

The ability to digitally replicate physical systems has been used to model hardware operations for many years, and more recently, digital twining technology has been applied to electronic systems to better simulate and troubleshoot the systems. As explained by Bryan Ramirez, Director of Industries, Solutions & Ecosystems,… Read More


Coverage Analysis in Questa Visualizer

Coverage Analysis in Questa Visualizer
by Bernard Murphy on 08-10-2022 at 6:00 am

Questa coverage

Coverage analysis is how you answer the question “have I tested enough?” You need some way to quantify the completeness of our testing; coverage is how you do that. Right out of the gate this is a bit deceptive. To truly cover a design our tests would need to cover every accessible state and state transition. The complexity of that task… Read More


EDA in the Cloud with Siemens EDA at #59DAC

EDA in the Cloud with Siemens EDA at #59DAC
by Daniel Payne on 08-01-2022 at 10:00 am

craig johnson

Tuesday at DAC I had the pleasure of attending the Design on Cloud Theatre where experts from Siemens EDA gave an update on what they’ve been offering to IC and systems designers. I remember attending a cloud presentation from Craig Johnson in 2021, so I was keen to note what had changed in the past 12 months.

Industry Trends,

Read More

Calibre, Google and AMD Talk about Surge Compute at #59DAC

Calibre, Google and AMD Talk about Surge Compute at #59DAC
by Daniel Payne on 07-25-2022 at 10:00 am

Google Cloud vendor of the year min

In 2022 using the cloud for EDA tasks is a popular topic, and at DAC this year I could see a bigger presence from the cloud hardware vendors in the exhibit area, along with a growing stampede of EDA companies. Tuesday at DAC there was a luncheon with experts from Siemens EDA, Google and AMD talking about surge compute. I already knew Michael… Read More