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SystemVerilog came to life in 2005 as a superset of Verilog-2005. The last IEEE technical committee revision of the SystemVerilog LRM was completed in 2016 and published as IEEE 1800-2017.
Have the last seven years revealed any changes or enhancements that maintain SystemVerilog’s relevance and efficaciousness in the face … Read More
Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More
According to McKinsey & Company, a digital twin is a digital representation of a physical object, person, or process, contextualized in a digital version of its environment. Digital twins can help an organization simulate real situations and their outcomes, ultimately allowing it to make better decisions. Anyone… Read More
SoC designs frequently have lots of different clock domains to help manage power more efficiently, however one side effect is that when the clock domains meet, i.e., in a Clock Domain Crossing (CDC), there’s the possibility of setup and hold time violations that can cause a flip-flop to become metastable. Synchronizer … Read More
Jean-Marie Brunet is Vice President and General Manager of Siemens Hardware-Assisted Verification. He and I spoke recently about how different his hardware group is from the rest of the software-centric EDA product space and why a hardware-oriented EDA vendor like Siemens fully understands the challenges of the chip design… Read More
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Consider RISC-V ISA as a new ‘unforbidden fruit’. Unlike other fruits (ISAs) that grow in proprietary orchards, RISC-V is available to all, i.e. open-source. Much like a delicious fruit can be transformed into a wide array of delectable desserts, so can RISC-V be utilized to create a plethora of effective applications across … Read More
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is more to cost than just area. For example, did you know that adding an additional metal layer to a chip dramatically increases the cost, sometimes by millions of dollars? It requires a … Read More
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