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Jean-Marie Brunet is Vice President and General Manager of Siemens Hardware-Assisted Verification. He and I spoke recently about how different his hardware group is from the rest of the software-centric EDA product space and why a hardware-oriented EDA vendor like Siemens fully understands the challenges of the chip design… Read More
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Consider RISC-V ISA as a new ‘unforbidden fruit’. Unlike other fruits (ISAs) that grow in proprietary orchards, RISC-V is available to all, i.e. open-source. Much like a delicious fruit can be transformed into a wide array of delectable desserts, so can RISC-V be utilized to create a plethora of effective applications across … Read More
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is more to cost than just area. For example, did you know that adding an additional metal layer to a chip dramatically increases the cost, sometimes by millions of dollars? It requires a … Read More
Custom and Analog-Mixed Signal (AMS) IC design are used when the highest performance is required, and using digital standard cells just won’t meet the requirements. Manually sizing schematics, doing IC layout, extracting parasitics, then measuring the performance only to go back and continue iterating is a long, tedious… Read More
Advanced process nodes create challenges for EDA both in handling ever larger designs and increasing design process complexity.
Shift-left design methodologies for design cycle time compression are one response to this. And this has also forced some rethinking about how to build and optimize design tools and flows.
SemiWiki… Read More
In the world of electronic systems design, complexity has always been a major challenge. As technology advances and demands for more efficient and powerful electronic devices grow, engineers face increasingly intricate design requirements. These complexities often lead to longer design cycles, increased costs, … Read More
Siemens EDA’s next move in its Calibre shift left strategy is the addition of correct-by-construction IC layout optimization for the most critical emerging physical design challenges. Calibre’s new DesignEnhancer product supports both custom and digital ICs and is already in use by several leading IC design companies. It … Read More
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