As electric vehicles (EVs) gain widespread adoption, safety, reliability, and efficiency are becoming increasingly important. A crucial component in ensuring these aspects is the power module (PM), which manages the energy flow between the EV battery and the motor. The design of these power modules must not only meet the high-performance… Read More
Electronic Design Automation
SI and PI Update from Cadence on Sigrity X
Signal Integrity (SI) and Power Integrity (PI) issues are critical to analyze, ensuring the proper operation of PCB systems and IC packages, yet the computational demands from EDA tools can cause engineers to only analyze what they deem are critical signals, instead of the entire system. Cadence has managed to overcome this SI/PI… Read More
Advanced Audio Tightens Integration to Implementation
You might think that in the sensing world all the action is in imaging and audio is a backwater. While imaging features continue to evolve, audio innovations may be accelerating even faster to serve multiple emerging demands: active noise cancellation, projecting a sound stage from multiple speakers, 3D audio and ambisonics,… Read More
Unlocking SoC Debugging Challenges: Paving the Way for Efficient Prototyping
As chip design complexity increases, integration scales expand and time-to-market pressures grow, as a result, design verification has become increasingly challenging. In multi-FPGA environments, the complexity of design debugging and verification further escalates, making it difficult for traditional debugging methods… Read More
Prioritize Short Isolation for Faster SoC Verification
Improve productivity by shifting left LVS
In modern semiconductor design, technology nodes continue to shrink and the complexity and size of circuits increase, making layout versus schematic (LVS) verification more challenging. One of the most critical errors designers encounter during LVS runs are shorted nets. Identifying… Read More
The Perils of Aging, From a Semiconductor Device Perspective
We‘re all aware of the challenges aging brings. I find the older I get, the more in touch I feel with those challenges. I still find it to be true that aging beats the alternative. I think most would agree. Human factors aside, I’d like to discuss the aging process as applied to the realm of semiconductor device physics. Here, as with… Read More
Navigating Resistance Extraction for the Unconventional Shapes of Modern IC Designs
The semiconductor industry is experiencing rapid evolution, driven by the proliferation of IoT applications, image sensors, photonics, MEMS applications, 3DIC and other emerging technologies. This growth has dramatically increased the complexity of integrated circuit (IC) design. One aspect of this complexity is the … Read More
Hearing Aids are Embracing Tech, and Cool
You could be forgiven for thinking of hearing aids as the low end of tech, targeted to a relatively small and elderly audience. Commercials seem unaware of advances in mobile consumer audio, and white-haired actors reinforce the intended audience. On the other hand, the World Health Organization has determined that at least 6%… Read More
CEO Interview: Tobias Ludwig of LUBIS EDA
Tobias began his journey with a strong academic foundation in electronic design automation, studying at a leading university in Germany that specialized in formal verification. After graduating, Tobias gained hands-on experience in the semiconductor industry, where he quickly recognized the challenges and inefficiencies… Read More
Webinar: When Failure in Silicon Is Not an Option
If the thought of a silicon respin keeps you awake at night, you’re not alone. Re-fabricating a chip can cost tens of millions of dollars. An unplanned respin also risks a delay in getting a product to market, which adds tremendous costs in terms of lost business.
Undoubtedly, adding to your sleep loss is the recent rise in respins.… Read More
The Intel Common Platform Foundry Alliance