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Most of us live perfectly good lives without distinction, fame, or note. Others rack up the honors, filling their walls and resumes with recognition of their brilliance. Like Dr. Janusz Rajski.
Rajski is the director of engineering for the test products at Mentor Graphics, an IEEE Fellow, and the inventor of embedded deterministic… Read More
At the keynote for ICCAD this morning, John Gustafson of AMD (where he is Chief Graphics Product Architect as well as a Fellow) talked about parallel algorithms. Like Gene Amdahl, whose law states that parallel algorithms are limited by the part that cannot be parallelized (if 10% is serial, then even if the other part takes place… Read More
Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More
Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More
Jasper Apps White Paperby Paul McLellan on 11-01-2012 at 7:30 pmCategories: EDA
Just in time for the Jasper User Group meeting, Jasper have a new white paper explaining the concept of JasperGold Apps.
First the User Group Meeting. It is in Cupertino at the Cypress Hotel November 12-13th. For more details and to register, go here. The meeting is free for qualified attendees (aka users). One thing I noticed at the… Read More
On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.
IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More
An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.
This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More
FPGA Prototyping is growing in popularity as a method to get an SoC design into hardware running at clock speeds up to 100MHz or so. One downside during traditional FPGA prototyping debug is the limited number of internal signals that you can observe while trying to chase down bugs in the hardware design in the presence of running … Read More
Jasper restructured JasperGold so that it could deliver its formal technology more flexibly by having a base system and a porfolio of apps. This would also make it easier to upgrade capabilities by creating new apps. Today, Jasper announced two new apps:
- JasperGold Structural Property Synthesis (SPS)
- JasperGold Behavioral
…
Read More
At DAC in June I visited and blogged about 30+ EDA and Semi IP companies, however I didn’t have time to watch the TowerJazz presentation in the Cadence Theater entitled: AMS Flow for Power Management Designs. Today I watched the 26 minute video and have summarized what I learned in this blog post.… Read More
Basilisk at Hot Chips 2025 Presented Ominous Challenge to IP/EDA Status Quo