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Global Design Closureby Paul McLellan on 01-09-2013 at 8:34 pmCategories: EDA
Satish Soman, chief solutions architect at Atrenta, was invited to give a presentation on Global Design Closure at the VLSI India conference in Pune at the start of this month. He talked about the need to close the gap between the typical SoC development methodology and what happens in reality.
SoCs are really put together in two … Read More
This morning I spoke with Mahesh Tirupattur, Executive VP of Analog Bits about IC design challenges and using EDA tools to create high performance, mixed-signal semiconductor IP.
… Read More
I love all things SPICE so when I read a tweet tonight from @PartSimI just had to try out their Schematic Capture and SPICE circuit simulator in a browser. The site is www.partsim.com and all you need is a web browser and short registration process, then it’s off to the Examples where I found a simple CMOS inverter and then extended… Read More
Last month the folks at Tektronix did something very useful, they invited 30 engineers to talk directly with their chief engineer of embedded instrumentation as part of “Meet the Experts” in Santa Clara, CA.
Brad Quinton, Chief Architect created a new and efficient approach of embedding instrumentation in your … Read More
Did you watch Atrenta’s holiday video (it’s only one minute)? Various Atrenta employees from all over the world wished you happy holidays in their own languages. Now Atrenta are having a competition. If you identify all the languages in the video then you can win an iPad Mini.
To enter the competition, or to view the … Read More
Our world is decidedly analog, made up of stimuli for our five basic senses of sight, touch, hearing, taste, and smell, and more advanced senses like balance and acceleration. To be effective on the Internet of Things, digital devices must integrate with the analog world, interfacing with sensors and control elements.… Read More
It has been a year since my article Semiconductor Landscape in Jan 2012 I wanted to look back into the major events over the year and then anticipate what’s in store going forward. What has happened over the year is much more than what I could foresee. Major consolidation in EDA space – Synopsys acquired Magma, SpringSoft, Ciranova,… Read More
A couple of weeks ago was the 3D Architectures for Semiconductor Integration and Packagingconference in Redwood City. Cadence presented the changes that they have been making to their tool flow to enabled 2.5D (interposer-based) and true 3D TSV-based designs. You know what TSV stands for by now right? Through-silicon-via, … Read More
I have no idea if chicken was actually on the menu, but on December 12, Calibre RealTime picked up its thirdindustry award, this time the 2012 Elektra Award for Design Tools and Development Software from the European Electronics Industry. Calibre RealTime came out on top in a group full of prestigious finalists, including ByteSnap,… Read More
Anyone who has been around technology consortia or standards bodies will tell you that the timeline from inception to mainstream adoption of a new embedded technology is about 5 years, give or take a couple dream cycles. You can always tell the early stage, where very different concepts try to latch on to the same, simple term.
Such… Read More
AI RTL Generation versus AI RTL Verification