SILVACO 051525 Webinar 800x100 v2
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TSMC Threater Presentation: Lorentz Solution!

TSMC Threater Presentation: Lorentz Solution!
by Daniel Nenni on 06-26-2012 at 8:30 pm

Lorentz Solution presented at TSMC’s DAC 2012 Open Innovation Platform Theater. The presenter was Lorentz Sales Director, Tom Simon. He presented what Lorentz calls its Electromagnetic Design and Analysis Platform. One of the main points of the talk was the cooperative work that Lorentz does with TSMC.

TSMC and Lorentz work … Read More


Robustness, Reliability and Yield at DAC

Robustness, Reliability and Yield at DAC
by Daniel Payne on 06-26-2012 at 8:15 pm

On Wednesday at DAC I met with Bob Slee, distributor and Michael Siu, AE for MunEDA to get an update on what’s new. MunEDA has EDA software for:

  • Schematic porting
  • Nominal circuit analysis
  • Nominal circuit optimization
  • Statistical circuit analysis
  • Statistical circuit optimization
  • IP porting
  • Circuit model generation
Read More

AMS Simulation Update from Mentor Graphics at DAC

AMS Simulation Update from Mentor Graphics at DAC
by Daniel Payne on 06-25-2012 at 12:36 pm

I met with Jay Madiraju of Mentor Graphics on Wednesday at DAC to get an update on their AMS simulation products. We worked together at Mentor back when Mach TA was being developed as a Fast SPICE circuit simulator.… Read More


FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More


TSMC Theater Presentation: Apache

TSMC Theater Presentation: Apache
by Paul McLellan on 06-25-2012 at 12:13 am

At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be … Read More


DesignSync update from Dassault Systems at DAC

DesignSync update from Dassault Systems at DAC
by Daniel Payne on 06-24-2012 at 8:10 pm

At DAC on Wednesday Rick Stanton of Dassault Systems gave me an update on what’s new with DesignSync, a design data management tool offered since 1998. Rick and I both worked at Viewlogic in the 90’s along with Dennis Harmon who then founded Synchronicity, later acquired by Dassault Systems.… Read More


Finding RTL Bugs Live Using Formal Techniques

Finding RTL Bugs Live Using Formal Techniques
by Daniel Payne on 06-24-2012 at 8:10 pm

Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days… Read More