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ARM adopting SpyGlass IP Kit, joining TSMC’s soft IP9000 Quality Assessment Program

ARM adopting SpyGlass IP Kit, joining TSMC’s soft IP9000 Quality Assessment Program
by Eric Esteve on 11-07-2012 at 12:17 pm

More than one year old now, TSMC’s soft IP quality assessment program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass checks that create detailed reports of the completeness and robustness of soft IP. This soft IP quality program has been the first to be initiated by a Silicon foundry on other than “Hard IP”,Read More


Solido and TSMC for 6-Sigma Memory Design

Solido and TSMC for 6-Sigma Memory Design
by Daniel Nenni on 11-06-2012 at 8:30 pm

Solido Design Automation and TSMC recently published an article in EE Times describing how Solido’s High-Sigma Monte Carlo tool is used with TSMC PDK’s to achieve high-yield, high-performance memory design. This project has been a big part of my life for the past three years and it is time for a victory lap!

In TSMC 28nm, 20nm and … Read More


Embedding 100K probes in FPGA-based prototypes

Embedding 100K probes in FPGA-based prototypes
by Don Dingee on 11-06-2012 at 8:15 pm

As RTL designs in FPGA-based ASIC prototypes get bigger and bigger, the visibility into what is happening inside the IP is dropping at a frightening rate. Where designers once had several hundred observation probes per million gates, those same several hundred probes – or fewer if deeper signal captures are needed – are now spread… Read More


A Most Significant Man

A Most Significant Man
by Beth Martin on 11-06-2012 at 8:10 pm

Most of us live perfectly good lives without distinction, fame, or note. Others rack up the honors, filling their walls and resumes with recognition of their brilliance. Like Dr. Janusz Rajski.

Rajski is the director of engineering for the test products at Mentor Graphics, an IEEE Fellow, and the inventor of embedded deterministic… Read More


Gustafson on Parallel Algorithms

Gustafson on Parallel Algorithms
by Paul McLellan on 11-05-2012 at 4:54 pm

At the keynote for ICCAD this morning, John Gustafson of AMD (where he is Chief Graphics Product Architect as well as a Fellow) talked about parallel algorithms. Like Gene Amdahl, whose law states that parallel algorithms are limited by the part that cannot be parallelized (if 10% is serial, then even if the other part takes place… Read More


Chip On Wafer On Substrate (CoWoS)

Chip On Wafer On Substrate (CoWoS)
by Daniel Payne on 11-03-2012 at 5:19 pm

tsmc cowos test vehicle1

Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More


Electromigration (EM) with an Electrically-Aware IC Design Flow

Electromigration (EM) with an Electrically-Aware IC Design Flow
by Daniel Payne on 11-03-2012 at 4:05 pm

fig2a

Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More


Jasper Apps White Paper

Jasper Apps White Paper
by Paul McLellan on 11-01-2012 at 7:30 pm

Just in time for the Jasper User Group meeting, Jasper have a new white paper explaining the concept of JasperGold Apps.

First the User Group Meeting. It is in Cupertino at the Cypress Hotel November 12-13th. For more details and to register, go here. The meeting is free for qualified attendees (aka users). One thing I noticed at the… Read More


SpyGlass IP Kit 2.0

SpyGlass IP Kit 2.0
by Paul McLellan on 11-01-2012 at 6:00 pm

On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.

IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More


IBM Tapes Out 14nm ARM Processor on Cadence Flow

IBM Tapes Out 14nm ARM Processor on Cadence Flow
by Paul McLellan on 10-30-2012 at 7:33 pm

An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.

This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More