Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More
Electronic Design Automation
Foundation IP for Automotive: so Stringent Quality Requirements!
The Automotive IC market is not the largest segment, but is certainly the segments expected to grow with the highest CAGR, with 10.8% from 2013 to 2018, according with IC Insights (January 2015). If you consider the pretty long concept/design to production cycle time (7 years or more) as well as the numerous segments just emerging… Read More
Optimization and verification wins in IoT designs
Designers tend to put tons of energy into pre-silicon verification of SoCs, with millions of dollars on the line if a piece of silicon fails due to a design flaw. Are programmable logic designers, particularly those working with an SoC such as the Xilinx Zynq, flirting with danger by not putting enough effort into verification?… Read More
Solido Saves Silicon with Six Sigma Simulation
When pushing the boundaries of power and performance in leading edge memory designs, yield is always an issue. The only way to ensure that memory chips will yield is through aggressive simulation, especially at process corners to predict the effects of variation. In a recent video posted on the Solido website, John Barth of Invecas… Read More
Are Your Transistor Models Good Enough?
SoC designers can now capture their design ideas with high-level languages like C and SystemC, then synthesize those abstractions down into RTL code or gates, however in the end the physical IC is implemented using cell libraries made up of transistors. Circuit designers use simulation tools like SPICE on these transistor-level… Read More
Semi execs look at IoT tradeoffs a bit differently
What happens when you get a panel of four executives together with an industry-leading journalist to discuss tradeoffs in IoT designs? After the obligatory introductions, Ed Sperling took this group into questions on power, performance, and integration.… Read More
Rigid-Flex Cabling is Cool! (and requires unique EDA support)
The three F’s of electronic product development are: form, fit, and function. Although the F/F/F assessment typically refers to the selection of the right component, it most definitely also refers to the selection of the proper cabling between assemblies. The requirements for cables are varied, and demanding: ability… Read More
Catching low-power simulation bugs earlier and faster
I’ve owned and used many generations of cell phones, starting back in the 1980’s with the Motorola DynaTAC phone and the biggest usability factor has always been the battery life, just how many hours of standby time will this phone provide and how many minutes of actual talk time before the battery needs to be recharged… Read More
Keynote: Silicon is the New Steel: Building the World’s First Terascale Network
Prof. Thomas Lee from Stanford University is the keynote speaker at the upcoming 38th EOS/ESD Symposium (September 11-16, Anaheim). The EOS/ESD Symposium is focused on discussing the issues and providing the answers to electrostatic discharge in electronic production and assembly.
Abstract:
Steel transformed civilization… Read More
Webinar Alert – Helping Mixed Signal not be Mixed Up
Today’s profound statement: “don’t fall in love with your tools, figure out the biz process change first.” Mixed-signal SoC designers are having ample challenges with their design process and are in need of design management, but don’t want another tool to do it.… Read More


AI Bubble?