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Parallel-Based PHY IP for Die-to-Die Connectivity

Parallel-Based PHY IP for Die-to-Die Connectivity
by Mike Gianfagna on 09-17-2020 at 10:00 am

Two converging trends for die to die connectivity in MCMs 1

 

Synopsys has released a Technical Bulletin entitled “Parallel-Based PHY IP for Die-to-Die Connectivity”. The piece is authored by Manuel Mota, senior product marketing manager, staff at Synopsys. Manuel has worked at Synopsys for 11 years in the IP area. Prior to that, he worked at MIPS Technologies, Chipidea (acquired… Read More


Anirudh CadenceLIVE Plays Up Computational Software

Anirudh CadenceLIVE Plays Up Computational Software
by Bernard Murphy on 09-17-2020 at 6:00 am

Anirudh min

Cadence has clearly found its groove with Intelligent System Design, something that Lip-Bu reinforced in the CadenceLIVE kickoff keynote on Tuesday, August 11th. Anirudh Devgan, president of Cadence, continued to discuss the theme in his keynote on Wednesday, August 12th with his equally consistent subtitle—”Strength… Read More


Trusted IoT Ecosystem for Security – Created by the GSA and Chaired by Mentor/Siemens

Trusted IoT Ecosystem for Security – Created by the GSA and Chaired by Mentor/Siemens
by Mike Gianfagna on 09-14-2020 at 10:00 am

MentorSiemens and the GSA Team to Create a Trusted IoT Ecosystem

There’s a lot to keep you awake at night these days. If you live in California, it’s wildfires and unbreathable air. If you live on planet Earth, it’s COVID-19. And if you’re part of the value chain for IoT, it’s the security and robustness of the silicon and software fabric that connects our world. This fabric connects everything,… Read More


CEO Interview: Pengwei Qian of SkillCAD

CEO Interview: Pengwei Qian of SkillCAD
by Daniel Nenni on 09-14-2020 at 6:00 am

IMG 4723

Pengwei Qian is the founder and CEO of SkillCAD, a grassroots EDA company that has amassed the most impressive customer list (60+ companies) I have experienced for a company of this size, absolutely.

Pengwei has a Bachelor’s degree in Physics and a Masters in Material Science from Fudan University and a Masters in Electronic Engineering… Read More


How HCL VersionVault Works – Directory Versioning

How HCL VersionVault Works – Directory Versioning
by Mike Gianfagna on 09-10-2020 at 10:00 am

Pieter Gosselink Senior Technical Support Engineer HCL Technologies

Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”

To recap, VersionVault delivers a lot of … Read More


Emulation as a Service Benefits New AI Chip

Emulation as a Service Benefits New AI Chip
by Bernard Murphy on 09-10-2020 at 6:00 am

Emulation as a Service

It’s no secret that innovation in AI chip architectures is on a tear. When you put together the spatial complexity of highly parallelized algorithms with the need to localize memory accesses on-chip to the greatest extent possible, we’re seeing a proliferation of all kinds of domain-specific architectures. Which in the normal… Read More


World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost

World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost
by Daniel Nenni on 09-03-2020 at 10:00 am

ANSYS IDEAS Airplane

Innovative Designs Enabled by Ansys Semiconductor

I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum!  IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor… Read More


Lip-Bu Hyperscaler Cast Kicks off CadenceLIVE

Lip-Bu Hyperscaler Cast Kicks off CadenceLIVE
by Bernard Murphy on 09-02-2020 at 6:00 am

Lip Bu min

Lip-Bu (Cadence CEO) sure knows how to draw a crowd. For the opening keynote in CadenceLIVE (Americas) this year, he reprised his data-centric revolution pitch, followed by a talk from a VP at AWS on bending the curve in chip development. And that was followed by a talk by a Facebook director of strategy and technology on aspects of… Read More


WEBINAR: Addressing Verification Challenges in the Development of Optimized SRAM Solutions with surecore and Mentor Solido

WEBINAR: Addressing Verification Challenges in the Development of Optimized SRAM Solutions with surecore and Mentor Solido
by Daniel Nenni on 09-01-2020 at 2:00 pm

surecore solido webinar graphic

After spending a significant amount of my career in the IP library business it was an easy transition to Solido Design. I spent 10+ years traveling the world with CEO Amit Gupta working with the foundries and their top customers. In fact, the top 40 semiconductor companies use Solido. IP companies are also big Solido users including… Read More


Creating Analog PLL IP for TSMC 5nm and 3nm

Creating Analog PLL IP for TSMC 5nm and 3nm
by Tom Simon on 09-01-2020 at 6:00 am

PLL Optimizations

TSMC’s Open Innovation Platform’s main objective is to create and promote partnership for producing chips. This year’s OIP event included a presentation on the joint efforts of Silicon Creations, Mentor, a Siemens business and TSMC to produce essential PLL IP for 5nm and 3nm designs. The relentless push for smaller geometries… Read More