SILVACO 073125 Webinar 800x100
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IP to SoC Flow Critical for ISO 26262

IP to SoC Flow Critical for ISO 26262
by Tom Simon on 12-17-2019 at 6:00 am

IP integration flow for functional safety

In thinking about automotive electronics safety standards, such as ISO 26262, it is easy to jump to the conclusion that they are in reference to systems such as autonomous driving, which are entering the marketplace. In reality, functional safety in automotive electronics plays a significant role in many well-established automotive… Read More


Useful Skew in Production Flows

Useful Skew in Production Flows
by Tom Dillinger on 12-13-2019 at 6:00 am

The concept of applying useful clock skew to the design of synchronous systems is not new.  To date, the application of this design technique has been somewhat limited, as the related methodologies have been rather ad hoc, to be discussed shortly.  More recently, the ability to leverage useful skew has seen a major improvement,… Read More


Another Smart EDA Merger Adds RF Tools

Another Smart EDA Merger Adds RF Tools
by Daniel Payne on 12-12-2019 at 10:00 am

Cadence acquires AWR

Mergers and acquisitions are just a fact of modern business life, so the semiconductor, IP and EDA industries all can benefit, but only when the two companies have complementary products with some actual synergy. Cadence acquired OrCAD back in 1999, adding a Windows-based PCB tool to their product lineup, and here in 2019 some … Read More


The First Must-Have in 5G

The First Must-Have in 5G
by Bernard Murphy on 12-11-2019 at 6:00 am

Bulk acoustic wave filter

If I was asked about must-have needs for 5G, I’d probably talk about massive MIMO and a lot of exotic parallel DSP processing, also perhaps need for new intelligent approaches to link adaptation and intelligent network slicing in the infrastructure. But there’s something that comes before that all that digital cleverness, in … Read More


WEBINAR: Analyzing PowerMOS Devices to Reduce Power Loss and Improve Reliability

WEBINAR: Analyzing PowerMOS Devices to Reduce Power Loss and Improve Reliability
by Daniel Nenni on 12-06-2019 at 6:00 am

The symbol for a PowerMOS device in a converter circuit schematic looks simple enough. However, it belies a great deal of hidden complexity. A single device is actually a huge array of parallel intrinsic devices connected together to act as a single high power device. While their gate lengths are small, as with many other MOS devices,… Read More


Webinar on coping with the complexities of 3D NAND design

Webinar on coping with the complexities of 3D NAND design
by admin on 12-03-2019 at 10:00 am

In order to beat Moore’s Law NAND Flash memories have moved from a planar topology to 3D construction. This allows for increased memory sized in much the same way a multistory building provides more building square footage on the same size building lot. Just like in building construction, adding a third dimension to the mix increases… Read More


Webinar Recap: IP Security Threats in your SoC

Webinar Recap: IP Security Threats in your SoC
by Daniel Payne on 11-28-2019 at 10:00 am

Methodics Security SoC

Three years ago my youngest son purchased a $17 smart watch on eBay, but then my oldest son read an article warning about how that watch would sync with your phone, then send all of your contact info to an address in China. My youngest son then wisely turned the watch off, and never used it again. Hackers have been able to spoof and hide Read More


Webinar Recap: Challenges of Autonomous Vehicle Validation

Webinar Recap: Challenges of Autonomous Vehicle Validation
by Daniel Payne on 11-27-2019 at 10:00 am

Waymo Jaguar

Autonomous vehicle progress is in the daily news, so it’s quite exciting to watch it develop with the help of SoC design, sensors, actuators and software from engineering teams spanning the entire globe. Tesla vehicles have reached Level 2 autonomy, Audi e-tron is at Level 3, and Waymo nearly at Level 5 with robot taxis being… Read More


MEMS Actuation and the Art of Prototyping

MEMS Actuation and the Art of Prototyping
by Bernard Murphy on 11-27-2019 at 5:00 am

Thermal actuator prototyping

I mentioned a while back that I’m really getting into the role that sensors play in our new hyper-connected world – in the IoT, intelligent cars, homes, cities, industry, utilities, medicine, agriculture, etc, etc. If we can think of a way to sense it and connect it, someone is probably already doing it. But there’s more to … Read More


Mentor unpacks LVS and LVL issues around advanced packaging

Mentor unpacks LVS and LVL issues around advanced packaging
by Tom Simon on 11-26-2019 at 6:00 am

Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More