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WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4171
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4171
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Webinar – IP for securing automotive systems

Webinar – IP for securing automotive systems
by admin on 11-19-2019 at 10:00 am

Modern cars have about as much in common with their predecessors as modern cell phones have in common with dial up land-line phones. Cars now are loaded with a bevy of electronics, some of which serve the convenience of the driver and others are essential for vehicle operation and occupant safety. With the introduction of sophisticated… Read More


ITC shines light on new Mentor Test announcements

ITC shines light on new Mentor Test announcements
by Tom Simon on 11-18-2019 at 10:00 am

The 50th International Test Conference was just held in Washington DC, where papers, sessions, workshops and announcements addressing the increasing complexity and expanding use of semiconductors showed that innovations in test are crucial to design and product success. Test methodologies and even the scope of test have … Read More


Synopsys Fusion Compiler Delivers ARM Hercules-Samsung 5LPE Design

Synopsys Fusion Compiler Delivers ARM Hercules-Samsung 5LPE Design
by Daniel Nenni on 11-15-2019 at 10:00 am

There were many interesting presentations at ARM TechCon this year besides the keynote addresses by Arm, which were truly stunning for content and production value. One very interesting presentation was the talk given in the afternoon of Wednesday, October 9, 2019, titled, Synopsys Fusion Compiler for Next Generation Arm HerculesRead More


Package Reliability Issues Cost Money

Package Reliability Issues Cost Money
by Tom Dillinger on 11-13-2019 at 6:00 am

Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die.  At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”.  The key takeaway messages… Read More


Mentor Adds Circuit Simulators to the Cloud using Azure

Mentor Adds Circuit Simulators to the Cloud using Azure
by Daniel Payne on 11-08-2019 at 6:00 am

Mentor and Azure

Most EDA tools started out running on mainframe computers, then minicomputers, followed by workstations and finally desktop PCs running Linux. If your SoC design team is working on a big chip with over a billion transistors, then your company likely will use a compute farm to distribute some of the more demanding IC jobs over lots… Read More


Webinar – 3D NAND Memory Cell Optimization

Webinar – 3D NAND Memory Cell Optimization
by admin on 11-07-2019 at 10:00 am

Flash memory has become ubiquitous, so much so that it is easy to forget what life before it was like. Large scale non-volatile storage was limited spinning disks, which were bulky, power hungry and unreliable. With NAND Flash, we have become used to carrying many gigabytes around with us all the time in the form of cell phones, USB… Read More


Calibre Commences Cloud Computing

Calibre Commences Cloud Computing
by Tom Simon on 11-06-2019 at 10:00 am

Calibre was a big game changer for DRC users when it first came out. Its hierarchical approach dramatically shortened runtimes with the same accuracy as other existing, but slower, flat tools. However, one unsung part of this story was that getting Calibre up and running required minimal effort for users. Two things are required… Read More


Cadence Dives Deeper at Linley Fall Processor Conference

Cadence Dives Deeper at Linley Fall Processor Conference
by Randy Smith on 11-05-2019 at 10:00 am

I wrote about Cadence AI IP not long ago when I covered the Cadence Automotive Summit at the end of July (Tensilica DNA 100 Brings the AI Inference Solution for Level 2 ADAS ECUs and Level 4 Autonomous Driving, Tensilica HiFi DSPs for What I Want to Hear, and What I Don’t Want to Hear). One of those two blogs remains one of my most widely … Read More


New ARC VPX DSP IP provides parallel processing punch

New ARC VPX DSP IP provides parallel processing punch
by Tom Simon on 10-29-2019 at 6:00 am

The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More