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Intel Ushers a New Era of Advanced Packaging with Glass Substrates

Intel Ushers a New Era of Advanced Packaging with Glass Substrates
by Mike Gianfagna on 09-18-2023 at 10:00 am

Intel Ushers a New Era of Advanced Packaging with Glass Substrates


Intel recently issued a press announcement that has significant implications for the future of semiconductors.  The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rulesRead More


Chiplets and IP and the Trust Problem

Chiplets and IP and the Trust Problem
by Bernard Murphy on 09-12-2023 at 6:00 am

Trust min

Perforce recently hosted a webinar on “IP Lifecycle Management for Chiplet-Based SoCs”, presented by Simon Butler, the GM for the Methodics IPLM BU. The central theme was trust, for IPs as much as chiplets. How can an IP/chiplet consumer trust that what they receive has not been compromised somewhere in the value chain from initial… Read More


Interface IP in 2022: 22% YoY growth still data-centric driven

Interface IP in 2022: 22% YoY growth still data-centric driven
by Eric Esteve on 09-04-2023 at 10:00 am

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We have shown in the “Design IP Report” 2022 that the market share of the wired Interface IP category is a growing part of the total IP, and that this trend is confirmed year after year. The interface IP category has moved from 18% share in 2017 to 25% in 2022.

During the 2010-decade, smartphone was the strong driver for the IP industry,… Read More


CEO Interview: Anna Fontanelli of MZ Technologies

CEO Interview: Anna Fontanelli of MZ Technologies
by Daniel Nenni on 08-18-2023 at 6:00 am

ANNA (1)

Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA … Read More


WEBINAR: The Power of Formal Verification: From flops to billion-gate designs

WEBINAR: The Power of Formal Verification: From flops to billion-gate designs
by Daniel Nenni on 08-15-2023 at 5:00 pm

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Semiconductor industry is going through an unprecedented technological revolution with AI/ML, GPU, RISC-V, chiplets, automotive and 5G driving the hardware design innovation. The race to deliver high performance, optimizing power and area (PPA), while ensuring safety and security is truly on. It has never been a more excitingRead More


Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023

Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
by Daniel Nenni on 06-19-2023 at 10:00 am

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As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More


Requirements for Multi-Die System Success

Requirements for Multi-Die System Success
by Daniel Nenni on 06-16-2023 at 6:00 am

Synopsys Chiplet Report 2023

Chiplets continue to be a hot topic on SemiWiki, conferences, white papers, webinars and one of the most active chiplet enabling vendors we work with is Synopsys. Synopsys is the #1 EDA and #1 IP company so that makes complete sense.

As you may have read, I moderated a panel on Chiplets at the last SNUG which we continue to write about.

Read More

TSMC Doubles Down on Semiconductor Packaging!

TSMC Doubles Down on Semiconductor Packaging!
by Daniel Nenni on 06-14-2023 at 6:00 am

TSMC 3DFabric Integration

Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.

Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More


WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
by Daniel Nenni on 06-12-2023 at 10:00 am

Figure 1 (2)

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.

The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More


WEBINAR: UCIe PHY Modeling and Simulation with XMODEL

WEBINAR: UCIe PHY Modeling and Simulation with XMODEL
by Daniel Nenni on 06-05-2023 at 6:00 am

UCIe image2

Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More