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Siemens Digital Industries Software Collaborates with AWS and Arm To Deliver an Automotive Digital Twin

Siemens Digital Industries Software Collaborates with AWS and Arm To Deliver an Automotive Digital Twin
by Mike Gianfagna on 11-28-2023 at 6:00 am

Siemens Digital Industries Software Collaborates with AWS and ARM To Deliver an Automotive Digital Twin

 

According to McKinsey & Company, a digital twin is a digital representation of a physical object, person, or process, contextualized in a digital version of its environment. Digital twins can help an organization simulate real situations and their outcomes, ultimately allowing it to make better decisions. Anyone… Read More


Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems

Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems
by Kalar Rajendiran on 11-06-2023 at 10:00 am

SDVs New Monetization Opportunities

The automotive industry is undergoing a major transformation; it is not about just connectivity and convenience anymore. Data is emerging as the driving force behind innovation and safety with vehicles becoming sophisticated data-driven machines. By unlocking the power of data, we can create safer vehicles and roads and usher… Read More


Arm Total Design Hints at Accelerating Multi-Die Activity

Arm Total Design Hints at Accelerating Multi-Die Activity
by Bernard Murphy on 11-02-2023 at 6:00 am

multi die

I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More


DVCon Europe is Coming Soon. Sign Up Now

DVCon Europe is Coming Soon. Sign Up Now
by Bernard Murphy on 10-31-2023 at 6:00 am

logo accellera min

I’m a fan of DVCon, a fan of Accellera and a fan of Munich, hosting DVCon Europe once again. This year’s event runs from November 14th through 15th (with some events on the 16th) at the Holiday Inn Munich in the City Center. Phillippe Notton (CEO, SiPearl) will deliver a keynote on “Energy Efficient High-Performance Computing in the… Read More


Powering eMobility Through Silicon-Carbide Substrates

Powering eMobility Through Silicon-Carbide Substrates
by Bernard Murphy on 10-25-2023 at 6:00 am

SOITEC SEPTEMBRE 2023

While writing on infotainment and ADAS I sometimes wonder about the devices that make an EV run. These have nothing to do with digital or software wizardry. While logic and software play a role, the real heart of EV power is in power electronics driving motors, regenerative braking and charger options at home and on the road. Technologies… Read More


FD-SOI, the technology shaping the future of automotive radars

FD-SOI, the technology shaping the future of automotive radars
by admin on 10-16-2023 at 6:00 am

White paper Figure 3

By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC

    I.          Introduction

Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More


Long-standing Roadblock to Viable L4/L5 Autonomous Driving and Generative AI Inference at the Edge

Long-standing Roadblock to Viable L4/L5 Autonomous Driving and Generative AI Inference at the Edge
by Lauro Rizzatti on 10-11-2023 at 6:00 am

Table I

Two recent software-based algorithmic technologies –– autonomous driving (ADAS/AD) and generative AI (GenAI) –– are keeping the semiconductor engineering community up at night.

While ADAS at Level 2 and Level 3 are on track, AD at Levels 4 and 5 are far from reality, causing a drop in venture capital enthusiasm and money. Today,… Read More


Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem

Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
by Kalar Rajendiran on 10-10-2023 at 10:00 am

L.C. OIP 2023

As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More


Soitec is Engineering the Future of the Semiconductor Industry

Soitec is Engineering the Future of the Semiconductor Industry
by Mike Gianfagna on 09-12-2023 at 10:00 am

Soitec is Engineering the Future of the Semiconductor Industry

The crystalline structure of silicon delivers the incredible capabilities that have fueled the exponential increases defined by Moore’s Law. It turns out that silicon in its purest form will fall short at times – power handling and speed are examples. In these cases, adding additional materials to the silicon can enhance its … Read More


ISO 21434 for Cybersecurity-Aware SoC Development

ISO 21434 for Cybersecurity-Aware SoC Development
by Kalar Rajendiran on 08-31-2023 at 10:00 am

Cybersecurity agreement in supply chain

The automotive industry is undergoing a remarkable transformation, with vehicles becoming more connected, automated, and reliant on software. While these advancements promise convenience, comfort and efficiency to the consumers, the nature and complexity of the technologies also raise concerns for functional safety … Read More