It might seem from popular debate around AI and agentic that everything in this field is purely digital, initiated through text or voice prompts, often cloud-based or on-prem. But that view misses so much. AI is already an everyday experience at the edge, for voice-based control, in object detection and safety-triggered braking… Read More
2026 Outlook with Kamal Khan of Perforce
Tell us a little bit about yourself and your company.
Kamal Khan, Vice President North America Automotive/Semiconductor at Perforce. Perforce is trusted by the world’s leading brands to drive quality, security, compliance, collaboration, and speed across the technology lifecycle. Our global footprint spans more than 80 … Read More
Curbing Soaring Power Demand Through Foundation IP
Power has become a very hot (ha-ha) topic. The media has latched onto the emergence of massive AI datacenters disrupting energy pricing for consumers. Both as consumers and in industry we welcome faster and better features in our hand-held computing devices, cars, homes, industrial processes and businesses. But without further… Read More
Automotive Digital Twins Out of The Box and Real Time with PAVE360
Digital twins are amazing technology, virtual representations mirroring a real physical system. Twin virtual models span software, electrical/electronic and mechanical subsystems, closing the loop with feedback from real physical counterparts. The virtual model calibrates against real sensing feedback gathered in … Read More
United Micro Technology and Ceva Collaborate for 5G RedCap SoC and Why it Matters
In the ultra competitive automotive technology race the integration of advanced connectivity is no longer a luxury but a necessity. As vehicles transition from isolated machines to intelligent nodes in a vast ecosystem, seamless, reliable communication becomes paramount. On November 11, 2025, Ceva, Inc., a leading licensor… Read More
Arm FCSA and the Journey to Standardizing Open Chiplet-Based Design
I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More
TSMC Kumamoto: Pioneering Japan’s Semiconductor Revival
In the lush landscapes of Kumamoto Prefecture, on Japan’s Kyushu Island, TSMC is etching a new chapter in global chip production. The TSMC Kumamoto facility, operationalized through its wholly-owned subsidiary Japan Advanced Semiconductor Manufacturing (JASM), represents the Taiwanese giant’s bold foray… Read More
Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
The IO Hub: An Emerging Pattern for System Connectivity in Chiplet-Based Designs
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
The Importance of Productizing AI. Everyday Examples
Keeping up with the furious pace of AI innovation probably doesn’t allow a lot of time for deep analysis across many use cases. However I can’t help feeling we’re sacrificing quality and ultimately end user acceptance of AI by prioritizing new capabilities over rigorous productization. I am certain that product companies do rigorous… Read More


TSMC vs Intel Foundry vs Samsung Foundry 2026