In the ultra competitive automotive technology race the integration of advanced connectivity is no longer a luxury but a necessity. As vehicles transition from isolated machines to intelligent nodes in a vast ecosystem, seamless, reliable communication becomes paramount. On November 11, 2025, Ceva, Inc., a leading licensor… Read More
Synopsys + NVIDIA = The New Moore’s Law
NVIDIA and Synopsys, two titans of the semiconductor ecosystem, announced a landmark multi-year strategic partnership backed by a $2 billion investment from NVIDIA into Synopsys-led initiatives. The collaboration aims to fuse NVIDIA’s GPU-accelerated computing platform with Synopsys’ industry-leading electronic … Read More
Arm FCSA and the Journey to Standardizing Open Chiplet-Based Design
I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More
TSMC Kumamoto: Pioneering Japan’s Semiconductor Revival
In the lush landscapes of Kumamoto Prefecture, on Japan’s Kyushu Island, TSMC is etching a new chapter in global chip production. The TSMC Kumamoto facility, operationalized through its wholly-owned subsidiary Japan Advanced Semiconductor Manufacturing (JASM), represents the Taiwanese giant’s bold foray… Read More
Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
The IO Hub: An Emerging Pattern for System Connectivity in Chiplet-Based Designs
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
The Importance of Productizing AI. Everyday Examples
Keeping up with the furious pace of AI innovation probably doesn’t allow a lot of time for deep analysis across many use cases. However I can’t help feeling we’re sacrificing quality and ultimately end user acceptance of AI by prioritizing new capabilities over rigorous productization. I am certain that product companies do rigorous… Read More
Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside
– Musk chip lifeline to Samsung comes with interesting strings attached
– Musk chose Samsung over Intel-What does that say about Intel?
– Musk will hold sway over Samsung much as Apple/NVDA over TSMC
– Will Musk do a “DOGE” on chip tool makers? How much influence?
Tesla/Samsung $16.5B deal
… Read MoreCEO Interview with Carlos Pardo of KD
Carlos Pardo has a distinguished career as a manager in the microelectronics industry, excelling in leading R&D teams. He possesses extensive expertise in the high-tech silicon sector, encompassing both hardware and software development. Previously, he served as the Technical Director at SIDSA, where he managed R&D… Read More
Arm Reveals Zena Automotive Compute Subsystem
Last year Arm announced their support for standards-based virtual prototyping in automotive, along with a portfolio of new AE (automotive enhanced) cores. They also suggested that in 2025 they would be following Arm directions in other LOBs by offering integrated compute subsystems (CSS). Now they have delivered: their Zena… Read More


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