Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Soitec: Materializing Future Innovations in Semiconductors
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
2025 Outlook with Uzi Baruch of proteanTecs
Tell us a little bit about yourself and your company.
I am the Chief Strategy Officer at proteanTecs where I oversee our organic and inorganic growth strategies, as well as our go-to-market. This includes collaboration with ecosystem partners, defining our business model, and creating value for our customers through a targeted… Read More
MCUs Are Now Embracing Mainstream NoCs
The moral of today’s story is that to succeed in a late-adopter market, sometimes you just have to wait for the market to catch up (assuming you have a strong early adopter market to buy your product today). I have been working with Arteris for 6+ years now promoting their NoC technology, and there was never any question that they offer… Read More
Accelerating Automotive SoC Design with Chiplets
The automotive industry is evolving rapidly with the increasing demand for intelligent, connected, and autonomous vehicles. Central to this transformation are System-on-Chip (SoC) designs, which integrate multiple processing units into a single chip for managing everything from safety systems to in-car entertainment.… Read More
CEO Interview with Dr. Dennis Michaelis of GEMESYS
Dr. Dennis Michaelis is the founder and CEO of the AI chip start-up. With a Ph.D. in Bio-Inspired Computing at the Purdue University in Indiana and a background in electrical engineering, he brings a unique blend of technical expertise and social commitment to the company. His previous role as Regional Director for Anonymous for… Read More
Accellera 2024 End of Year Update
From my viewpoint, standards organizations in semiconductor design always looked like they were “sharpening the saw”: further polishing/refining what we already have but not often pushing on frontiers. Very necessary of course to stabilize and get common agreement in standards but equally always seeming to be behind the innovation… Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules
The development of electric vehicles (EVs) is key to transitioning to sustainable transportation. However, designing high-performance EVs presents significant challenges, particularly in power module design. Power modules, including inverters, bulky DC capacitors, power management ICs (PMICs), and battery packs, … Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing