This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The presentation covered here from Synopsys focuses on the… Read More
Artificial Intelligence
Anirudh CadenceLIVE Plays Up Computational Software
Cadence has clearly found its groove with Intelligent System Design, something that Lip-Bu reinforced in the CadenceLIVE kickoff keynote on Tuesday, August 11th. Anirudh Devgan, president of Cadence, continued to discuss the theme in his keynote on Wednesday, August 12th with his equally consistent subtitle—”Strength… Read More
AI in Korea. Low-Key PR, Active Development
Based on press coverage and technical paper volume, you could be forgiven for thinking that Korea had decided to take a pass on AI mania, or maybe just to dabble a little here and there to stay abreast of trends. But you’d be wrong. Korea is very active in AI; they don’t feel a need to trumpet what they’re doing from the rooftops. If you … Read More
Emulation as a Service Benefits New AI Chip
It’s no secret that innovation in AI chip architectures is on a tear. When you put together the spatial complexity of highly parallelized algorithms with the need to localize memory accesses on-chip to the greatest extent possible, we’re seeing a proliferation of all kinds of domain-specific architectures. Which in the normal… Read More
Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More
Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. This presentation is from Alchip, presented by James Huang,… Read More
Cerebras and Analog Bits at TSMC OIP – Collaboration on the Largest and Most Powerful AI Chip in the World
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The topic at hand was full of superlatives, which isn’t surprising… Read More
Lip-Bu Hyperscaler Cast Kicks off CadenceLIVE
Lip-Bu (Cadence CEO) sure knows how to draw a crowd. For the opening keynote in CadenceLIVE (Americas) this year, he reprised his data-centric revolution pitch, followed by a talk from a VP at AWS on bending the curve in chip development. And that was followed by a talk by a Facebook director of strategy and technology on aspects of… Read More
Cadence Increases Verification Efficiency up to 5X with Xcelium ML
SoC verification has always been an interesting topic for me. Having worked at companies like Zycad that offered hardware accelerators for logic and fault simulation, the concept of reducing the time needed to verify a complex SoC has occupied a lot of my thoughts. The bar we always tried to clear was actually simple to articulate… Read More
New Processor Helps Move Inference to the Edge
Many of the most compelling applications for Artificial Intelligence (AI) and Machine Learning (ML) are found on mobile devices and when looking at the market size in that arena, it is clear that this is an attractive segment. Because of this, we can expect to see many consumer devices having low power requirements at the edge with… Read More


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