Calibre Commences Cloud Computing

Calibre Commences Cloud Computing
by Tom Simon on 11-06-2019 at 10:00 am

Calibre was a big game changer for DRC users when it first came out. Its hierarchical approach dramatically shortened runtimes with the same accuracy as other existing, but slower, flat tools. However, one unsung part of this story was that getting Calibre up and running required minimal effort for users. Two things are required… Read More


BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA

BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA
by Tom Simon on 10-31-2019 at 6:00 am

Back in May I wrote an article on the new Speedster7t from Achronix. This chip brings together Network on Chip (NoC) interconnect, high speed Ethernet and memory connections, and processing elements optimized for AI/ML. Speedster7t is a very exciting new FPGA that can be used effectively to accelerate a wide range of processing… Read More


New ARC VPX DSP IP provides parallel processing punch

New ARC VPX DSP IP provides parallel processing punch
by Tom Simon on 10-29-2019 at 6:00 am

The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More


IP-XACT helps you produce exactly what you need in SoC deliverables

IP-XACT helps you produce exactly what you need in SoC deliverables
by Tom Simon on 10-24-2019 at 10:00 am

If you have ever watched an experienced glass blower, your first thought is that they make it look so easy. I have had the opportunity to blow glass, and I can tell you that it is a constant struggle against temperature, time and muscles to get the glass to do anything like what you want. This is akin to what is required to take the elements… Read More


Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Free webinar – Accelerating data processing with FPGA fabrics and NoCs

Free webinar – Accelerating data processing with FPGA fabrics and NoCs
by Tom Simon on 10-14-2019 at 10:00 am

FPGAs have always been a great way to add performance to a system. They are capable of parallel processing and have the added bonus of reprogramability. Achronix has helped boost their utility by offering on-chip embedded FPGA fabric for integration into SoCs. This has had the effect of boosting data rates through these systems… Read More


Mentor’s Questa verification tools now run on 64-bit ARM based servers

Mentor’s Questa verification tools now run on 64-bit ARM based servers
by Tom Simon on 10-10-2019 at 10:00 am

The server market has been undergoing changes in the last few years. The traditional go-to for server processors had been x86 based chips from Intel or AMD. However, if you go on Amazon AWS looking for EC2 instances, you will see the “A1” instance type, which is an ARM based instance. This is not what you might think at first. The A1 instance… Read More


Functional Safety ARC Processor IP will speed automotive system design

Functional Safety ARC Processor IP will speed automotive system design
by Tom Simon on 10-09-2019 at 10:00 am

In the automotive space you can’t even get out of the starting gate without Functional Safety (FS). All electronic system that go into cars must have ISO 26262 certification. However, this is not something you slap on after the fact. From the ground up the requirements for ISO 26262 must be considered and the proper processes must… Read More


Synopsys and Infineon prepare for expanding AI use in automotive applications

Synopsys and Infineon prepare for expanding AI use in automotive applications
by Tom Simon on 10-03-2019 at 10:38 am

We all know that cars are using processors for many tasks, but it is easy to fail to comprehend just how many there are in a typical modern car. Browsing through the Infineon AURIX automotive processor application guide, you can start to see just how pervasive processors are. The AURIX processors are specifically designed for automotive… Read More


Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market

Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market
by Tom Simon on 09-24-2019 at 6:00 am

A few years back people were saying that the “EDA” problem was solved and that design tools had become commodity. At the same time people hailed ADAS, smart homes, mobile communication and AI as the frontiers of electronics.  Perhaps it could be said that layout tools, routers, placers, and circuit simulators had largely matured… Read More