How to Enable High-Performance VLSI Engineering Environments

How to Enable High-Performance VLSI Engineering Environments
by Kalar Rajendiran on 04-25-2023 at 10:00 am

License Operations Figure

Very Large Scale Integration (VLSI) engineering organizations are known for their intricate workflows that require high-performance simulation software and an abundance of simulation licenses to create cutting-edge chips. These workflows involve complex dependency trees, where one task depends on the completion of another… Read More


Synopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC

Synopsys Accelerates First-Pass Silicon Success for Banias Labs’ Networking SoC
by Kalar Rajendiran on 04-24-2023 at 8:00 am

Image to Depict Optical SoC

Banias Labs is a semiconductor company that develops infrastructure solutions for next-generation communications. Its target market is the high-performance computing infrastructure market including hyperscale data center, networking, AI, optical module, and Ethernet switch SoCs for emerging high-performance computing… Read More


Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links

Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links
by Kalar Rajendiran on 04-18-2023 at 10:00 am

Pre and Post FEC BER as FEC Matrix size Reduces

As digital transmission speeds increase, designers use various techniques to improve the signal-to-noise ratio at the receiver output. One such technique is the Decision Feedback Equalizer (DFE) scheme, commonly used in high-speed Serializer-Deserializer (SerDes) circuits to mitigate the effects of channel noise and … Read More


Optimizing Return on Investment (ROI) of Emulator Resources

Optimizing Return on Investment (ROI) of Emulator Resources
by Kalar Rajendiran on 04-12-2023 at 6:00 am

Verification Options SW vs HAV

Modern day chips are increasingly complex with stringent quality requirements, very demanding performance requirement and very low power consumption requirement. Verification of these chips is very time consuming and accounts for approximately 70% of the simulation workload on EDA server farms. As software-based simulators… Read More


Full-Stack, AI-driven EDA Suite for Chipmakers

Full-Stack, AI-driven EDA Suite for Chipmakers
by Kalar Rajendiran on 04-03-2023 at 6:00 am

Synopsys.ai Industry First AI driven Full EDA Suite

Semiconductor technology is among the most complex of technologies and the semiconductor industry is among the most demanding of industries. Yet the ecosystem has delivered incredible advances over the last six decades from which the world has benefitted tremendously. Yes, of course, the markets want that break-neck speed… Read More


Securing Memory Interfaces

Securing Memory Interfaces
by Kalar Rajendiran on 03-30-2023 at 10:00 am

synopsys secure ddr controller with ime

News of hackers breaking into systems is becoming common place these days. While many of the breaches reported to date may have been due to security flaws in software, vulnerabilities exist in hardware too. As a result, the topic of security is getting increased attention within the semiconductor industry around system-on-chip… Read More


Adaptive Clock Technology for Real-Time Droop Response

Adaptive Clock Technology for Real-Time Droop Response
by Kalar Rajendiran on 03-30-2023 at 6:00 am

Example Sea of Processor SoC with Distributed Generate Modules for Local Droop Response

In integrated circuit terminology, a droop is the voltage drop that happens in a circuit. This is a well-known phenomenon and can happen due to the following reasons. The power supply falls below the operating range for which a chip was designed for, resulting in a droop. More current is drawn by the conductive elements than they … Read More


The Rise of the Chiplet

The Rise of the Chiplet
by Kalar Rajendiran on 03-28-2023 at 10:00 am

Open Chiplet Economy

The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More


Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More


Semiconductors and Mobile Communications: 5G and Beyond

Semiconductors and Mobile Communications: 5G and Beyond
by Kalar Rajendiran on 03-06-2023 at 6:00 am

RF Front End Increasing in Complexity

Mobile World Congress (MWC) is the world’s largest gathering of mobile industry innovators where one can hear the latest on advanced technologies and solutions. This year, it took place from February 27 through March 2. Soitec was there to share their insights on how mobile communications are going to evolve with 5G and beyond … Read More