Spectre from Cadence Goes FastSPICE

Spectre from Cadence Goes FastSPICE
by Daniel Payne on 10-09-2013 at 2:31 am

Transistor-level circuit designers have an insatiable appetite to run numerous SPICE circuit simulations in order to determine circuit speed, current and power across Process, Voltage and Temperature (PVT) conditions. Just look at the number of PVT corners increasing as the technology nodes go to 16nm:

The good news today … Read More


High resolution Analog CMOS IC Design

High resolution Analog CMOS IC Design
by Daniel Payne on 10-04-2013 at 5:02 pm

My background includes transistor-level IC design, so I take delight in talking with engineers like Dr. Lanny Lewyn that are still practicing the art and science of analog IC design. Dr. Lewynis a Life Senior Member of the IEEE and has a consulting business. If you live in Santa Clara, then consider attending a live seminar on OctoberRead More


A Mixed-Signal IC Summit in San Jose

A Mixed-Signal IC Summit in San Jose
by Daniel Payne on 10-03-2013 at 9:26 am

Analog and mixed-signal ICs are tougher to design and verify compared to digital, so if you want to learn more about best practices from actual AMS engineers then consider attending a summitthat is sponsored by Cadence Design Systems next Thursday, October 10th in San Jose from 8:00AM until 6:30PM.

They’ve lined up an interesting… Read More


Architecture-level Power Modeling Methodology at Samsung

Architecture-level Power Modeling Methodology at Samsung
by Daniel Payne on 10-02-2013 at 10:58 am

At DAC this year there was a presentation from Samsung titled, “Profile-based Architecture Power Modeling Methodology for AP/SoC Product”. I’ve been using Samsung Smart Phones for the past four generations, so was very curious about how they have managed to improve the average battery life from less than… Read More


SystemVerilog Assertions and Functional Coverage

SystemVerilog Assertions and Functional Coverage
by Daniel Payne on 09-24-2013 at 8:26 pm

Ashok Mehtahas designed processors at DEC and Intel, managed ASIC vendor relationships, verified networks SoCs, directed engineers at AMCC, and used SystemVerilog since it’s inception. He recently authored a book: SystemVerilog Assertions and Functional Coverage. The book is available in both hardcover and Kindle… Read More


Who is Blogging at Cadence?

Who is Blogging at Cadence?
by Daniel Payne on 09-20-2013 at 1:31 pm

As a blogger in the EDA industry I get to write every week, however I also end up reading every blog on SemiWiki plus multiple other sites to keep current on what’s happening in our business. I thought that it would be informative to look at Cadence Design Systems and how they are using blogging to talk not just about their own EDA… Read More


Cutting Debug Time of an SoC

Cutting Debug Time of an SoC
by Daniel Payne on 09-19-2013 at 2:26 pm

The amount of time spent debugging an SoC dwarfs the actual design time, with many engineering teams saying that debug and verification takes about 7X the effort as the actual design work. So any automation to reduce the amount of time spent in debug and verification would directly impact the product schedule in a big way.

An example… Read More


A Brief History of Magillem

A Brief History of Magillem
by Daniel Payne on 09-19-2013 at 1:17 pm

Founders

Cyril Spasevski is the President, CTO and founding engineer at Magillem, bringing a team of engineers, all experts with an SoC platform builder tool. In 2006 Cyril and his team met a seasoned business woman, and decided to form Magillem. Design teams were struggling with different tools at different stages of the flow,… Read More


A Hybrid Test Approach – Combining ATPG and BIST

A Hybrid Test Approach – Combining ATPG and BIST
by Daniel Payne on 09-09-2013 at 5:18 pm

In the world of IC testability we tend to look at various approaches as independent means to an end, namely high test coverage with the minimum amount of test time, minimum area impact, minimum timing impact, and acceptable power use. Automatic Test Pattern Generation (ATPG) is a software-based approach that can be applied to any… Read More


Test Compression and Hierarchy at ITC

Test Compression and Hierarchy at ITC
by Daniel Payne on 09-09-2013 at 8:00 am

The International Test Conference (ITC) is this week in Anaheim and I’ve just learned what’s new at Synopsys with test compression and hierarchy. Last week I spoke with Robert Ruiz and Sandeep Kaushik of Synopsys by phone to get the latest scoop. There are two big product announcements today that cover:… Read More