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MEMS Update from DACby Daniel Payne on 06-11-2014 at 11:32 amCategories: Coventor, EDA
DAC has an interesting mix of vendors each year, and some of them are outside of the expected digital, analog or IP space. Last Tuesday at DAC I visited a company called Coventor that has three product lines:
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Even though I live just 7 miles away from the Mentor Graphics corporate office in Oregon, I visited their DAC suite in San Francisco last week to get an update on Calibrefrom Michael White. The Calibre tools are used during IC verification and sign-off by performing DRC (Design Rule Checking) and LVS (Layout Versus Schematic).… Read More
Tuesday morning at DAC I enjoyed a free breakfast courtesy of Synopsysand GLOBALFOUNDRIESwhere I learned more about the emerging market of IoT, and what it means to semiconductor, EDA and IP vendors. Panelists included: Semico Research, HP, Synopsys, GLOBALFOUNDRIES and Broadcom. … Read More
When I hear the phrase “high sigma” I think of the EDA vendor Solido, however at DAC on Monday I visited another EDA company called MunEDAthat has several products of interest to transistor-level IC designers. I was able to speak with three different people from MunEDA and here’s what I learned.… Read More
Synopsyshosted an AMS Luncheon panel today at DACin the Westin Hotel and invited four customers to talk about their actual design challenges and experiences. I’ve typed up my notes from this event.… Read More
First thing at DACtoday I met with Greg Lebsack of Tanner EDA to ask about what’s new in the past year for his EDA company. Here are my meeting notes, so there’s not much prose for my DAC blogs this year.
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Gary Smith at DACby Daniel Payne on 06-01-2014 at 9:27 pmCategories: EDA
Gary Smith once again wore his signature white coat and extolled the virtues of system level design and automation. The room at the Intercontinental was packed, and the folks in the hallway outside were noisy as usual, eager for the party to start after Gary finished.… Read More
My former co-worker, Kenneth Bakalar at Mentor Graphics is an expert in AMS modeling languages and UPFmethodology, so he recently teamed up with Eric Jeandeau to author an interesting white paper: Interpreting UPF for a Mixed-Signal Design Under Test. This white paper is based on a presentation made at DVCon earlier this year.… Read More
In the EDA world we use hyphens quite often to describe our technical approaches, like: DFM-aware, Power-aware, Variation-aware. I just read a white papertoday on the topic of Quality-Aware IP Design Flows, written by Fractal Technologies. If your group creates IP or re-uses IP, then there’s always the question about … Read More
Gary Smith published a list of what to see at DAC, and I noticed that he listed DOCEA Power in a category of ESL Thermal. I’ll be meeting the DOCEA engineers on Wednesday at DAC to learn more about their two newest ESL products:
- Thermal Profiler
- Power Intelligence
In general DOCEA Power tools allow you to manage power and thermal… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools