In the early days of Customer Owned Tooling (COT) the signoff was done at the GDS II, or physical level. Today, however we see the trend of RTL signoff instead because of the EDA tools and methodology available. At DACearlier this month I met with Piyush Sanchetiof Atrenta to get an update on what’s new with RTL signoff.… Read More
Author: Daniel Payne
Virtual Prototype Update from #51DAC
EDA industry pundit Gary Smithhas been talking about the electronics industry adopting an ESL tool flow for decades, so it was my pleasure to speak with Bill Neifertof Carbon Design Systemsat DAC this month because his company has been offering both tools and models that enable a virtual prototyping design flow.… Read More
High Level Synthesis update from #51DAC
Every since Synopsys dominated the logic synthesis market in the 1980’s we’ve had something called HLS – High Level Synthesis, meaning something higher than what Design Compiler can understand as input. At DACthis year I met with Mark Milligan of Calypto to get an update on what’s new with HLS. I first… Read More
Standard Cell, IO and Hard IP Validation update
Every SoC team uses libraries of cells to get their new product to market quicker: Standard Cells, IO Cells and Hard IP blocks. One immediate question that comes to my mind is, “How clean are these cells?” Validating your cell libraries first makes sense, and will ensure that there are fewer surprises as your chip gets… Read More
IP Management Update at DAC
To keep track of my business and personal finances I use software from Quicken, but for an SoC with hundreds of IP blocks how do you keep track of everything? The answer is found in the growing field of EDA tools for IP management, and at DACearlier this month I sat down with Neil Handof Methodics to get an update on what the industry trends… Read More
What’s New with Circuit Simulation for Cadence?
Every year at DAC I enjoy making the rounds to see what’s new with SPICE circuit simulators, so on June 3rd I met with Xiuya Liand Dan Zhuof Cadence in San Francisco to get an update about their Spectre tool. There’s plenty of competition in the SPICE area from Mentor Graphics (Analog FastSPICE, Eldo, ADiT), Synopsys … Read More
ESL Tool Update from #51DAC
As promised in my May 27th blog, I visited an ESL company at DAC three weeks ago that introduced two new tools:
- Thermal Profiler
- Power Intelligence
Noise-Coupled Analysis for Automotive ICs at DAC
My favorite method to learn about EDA tools at DAC is by listening to actual IC designers, so on June 3rd I heard Jacob Bakker from NXP talk about his experience with noise coupled analysis for advanced mixed-signal automotive ICs.… Read More
Workshop: Embedded Applications and Kernels
Design Automation Conference Workshop on Suite of Embedded Applications and Kernels
In June, the first Suite of Embedded Applications and Kernels, or SEAK, workshop at the 2014 Design Automation Conference in San Francisco introduced a new Defense Advanced Research Projects Agency program in the area of embedded system benchmarking… Read More
EDA for Power Management ICs at DAC
I first met Dundar Dumlugolat Barcelona Design back in 2004, so it was a pleasure to meet with him again at DAClast week and learn more about what his company Magwel has to offer IC designers of power management chips.… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools