Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory Controller… Read More
Author: Daniel Nenni
CEO Interview: Fares Mubarak of SPARK Microsystems
Fares Mubarak is a seasoned Global Executive with more than 30 years of broad management and hands-on experience spanning semiconductor design, software development, operations, sales, marketing, applications, EDA and healthcare IT.
Mubarak was VP/GM of the Semiconductor Business Unit followed by VP of Semiconductor Industry… Read More
Live 58th Design Automation Conference Coverage!
My beautiful first mate and I will be together at DAC this year. Her first DAC was 1985 in Las Vegas and we lived happily ever after. SemiWiki bloggers Tom Dillinger and Daniel Payne will also be at DAC attending sessions and meeting with exhibiting companies to learn and blog about the latest innovations inside the semiconductor … Read More
CEO Interview: Da Chuang of Expedera
Da is co-founder and CEO of Expedera. Previously, he was cofounder and COO of Memoir Systems, an optimized memory IP startup, leading to a successful acquisition by Cisco. At Cisco, he led the Datacenter Switch ASICs for Nexus 3/9K, MDS, CSPG products. Da brings more than 25 years of ASIC experience at Cisco, Nvidia, and Abrizio.… Read More
Continuous Integration of RISC-V Testbenches
In my last blog post about AMIQ EDA, I talked with CEO and co-founder Cristian Amitroaie about their support for continuous integration (CI). We discussed in some detail how their Design and Verification Tools (DVT) Eclipse Integrated Development Environment (IDE) and Verissimo SystemVerilog Linter are used in CI flows. Cristian… Read More
Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC
Ansys and Microsoft collaborated extensively over the past year to optimize and test Ansys’ signoff multiphysics simulation tools on the Azure cloud. Microsoft has invited Ansys to present the joint results in Azure’s DAC booth theater in San Francisco this year.
Two presentations are planned: covering the enablement of Ansys… Read More
CEO Interview: Mo Faisal of Movellus
Prior to founding Movellus, Dr. Faisal held positions at semiconductor companies such as Intel and PMC Sierra. Faisal received his B.S. from the University of Waterloo, and his M.S. and Ph.D. from the University of Michigan, and holds several patents. Dr. Faisal was named a “Top 20 Entrepreneur” by the University of Michigan Zell… Read More
Siemens EDA will be returning to DAC this year as a Platinum Sponsor.
The 38th Design Automation Conference is next week and this one is for the record books. Having been virtual the last two years, next week we will meet live once again. I think we may have all taken for granted the value of live events but now we know how important they are on both a professional and human level, absolutely.
“The… Read More
Empyrean Technology‘s Complete Design Solution for PMIC
Power management integrated circuits (PMICs) are integrated circuits for power management. Driven by the strong demand in consumer electronics, IoT, and the automobile industry, the design for PMIC is getting more challenging in terms of integration, reliability and efficiency. The design methodology needs to be updated… Read More
CEO Interview: Pradeep Vajram of AlphaICs
Pradeep Vajram is a successful entrepreneur and a veteran in the Semiconductor / Embedded industry. He has over 25+ years of experience in having executed, at all levels of responsibilities, in design and development of ASIC products.
Pradeep has been an active investor in semiconductor and deep tech USA-INDIA corridor start-up,… Read More








Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business